先进Via-Pillar工艺下VLSI性能驱动多层布线算法研究

Via-Pillar工艺是7纳米芯片设计中一个代表性技术，与VLSI布线的联系最为紧密。目前业界关于该工艺的启用大多基于手工设计，且学术界尚未开展相关研究，缺乏该先进工艺下一个有效、完整的布线流程。为此，本项目研究在该工艺下性能驱动多层布线器的构建：（1）根据业界提供的Via-Pillar工艺的特点，定义其模型和类型，考虑到通孔的大小，建立适应该工艺新颖的布线模型，设计基于协商机制的三阶段时延驱动层分配算法；（2）针对Via-Pillar工艺下的轨道分配问题，设计考虑通孔位置的新评价模型，基于多目标粒子群优化构建高效的可平行化算法；（3）设计可平行化构建的生成图并提出相应的图约简技术，基于图上Steiner树算法，构建时延驱动详细布线算法；（4）充分利用原有布线资源，基于动态存储图策略、A*算法和整数线性规划，构建时延驱动ECO布线算法，最终构建该工艺下有效、完整的布线流程。

The Via-Pillar technology is the next representative technology in the 7 nanoscale chip design, which is most closely related to the VLSI routing. At present, the industry's implementation of Via-Pillar technology is mostly based on manual design and the academia has not carried out the relevant research yet. Therefore, there is a lack of an effective and complete routing process under the advanced technology. To this end, the project studies the construction of a performance-driven multilayer router under the proposed advanced technology: (1) According to the characteristics of the Via-Pillar technology provided by the industry, we define its models and types. Considering the size of via, we have constructed a novel routing model, which is suitable for the proposed advanced technology, and then a three-stage timing driven layer assignment algorithm based on negotiation mechanism is proposed. (2) This project studies the track assignment problem arising from the Via-Pillar technology, and then a new evaluation model considering the location of the via is proposed. And then an efficient parallel algorithm based on multi-objective particle swarm optimization is proposed to solve the proposed track assignmetn problem. (3) We design a spanning graph model that can be constructed in parallel, and then a timing driven detailed routing algorithm based on the Steiner tree algorithm on the graph is proposed. (4) We reuse the original routing resources, and then we present a timing driven ECO routing algorithm based on a dynamic storage strategy, A* algorithm and integer linear programming. An effective and complete routing process under the advanced technology are finally proposed.