高精度聚合物柔性薄膜衬底的制备加工是柔性电子发展的关键技术之一。针对聚合物柔性薄膜目前难以实现高精度大面积制备的难题，本项目拟通过旋涂工艺优化提高聚合物薄膜的全局厚度均一性，在此基础上使用超低温磨削的方法提高局部平整性，并展开相关基础理论研究。研究立足于建立考虑气液界面以及固液界面的相变等因素的理论模型，深入揭示柔性聚合物薄膜旋涂成膜机理，提高大面积旋涂薄膜的厚度均一性；探索超低温环境下实现“玻璃化”转化的聚合物的物理特性，揭示磨削加工时的去除和损伤机理，研究聚合物柔性薄膜大面积高精度磨削加工方法，最终开发出高精度柔性薄膜旋涂-超低温磨削复合制备方法。这一研究不仅对柔性电子的发展具有重要意义，也拓展了磨削加工的应用领域，为具有软韧特性的聚合物材料的磨削加工工艺研究提供了理论基础。

The manufacturing of high-precision flexible polymer thin film applied in the substrate of Flexible Electronics has been one of the key problems impeding the development of Flexible Electronics. At present, the flexible polymer thin film is still difficult to achieve high precision in large area production. And it is also difficult to cut with traditional machining method. In this project, the cryogenic grinding method is applied based on the characteristics of polymer glass transition and the related basic theory is studied. The study focuses on the deep analysis of flexible polymer film spin-coating mechanism. A theoretical model considering gas-liquid interface and the phase change of liquid-solid interface is set up in order to improve the utilization rate of polymer materials. The physical properties of polymer after glass transition in the ultra-low temperature is also explored. Additionally, the removal and damage mechanism of grinding process is revealed, and the solution of large area and high precision flexible polymer film manufacturing is proposed. This study puts emphasis on grinding process with liquid nitrogen and provides a new grinding method for polymer materials with soft tenacity properties. Also, this project provides theoretical basis for polymer grinding process. This research not only has important theoretical significance to the development of flexible electronics, but also extends the application field of grinding.