Microstructure and strengthening mechanism of Si3N4/Invar joint brazed with TiNp-doped filler
Microstructure and strengthening mechanism of Si3N4/Invar joint brazed with TiNp-doped filler
复制标题
TiNp掺杂钎焊Si3N4/Invar接头的显微组织及强化机制
DOI：
10.1016/j.msea.2015.10.038
复制
发表时间：
2016-01
期刊：
影响因子：
6.4
通讯作者：
Zhang Jie
中科院分区：
文献类型：
--
作者：
Wang Tianpeng;Chunfeng Liu;Leinenbach Christian;Zhang Jie
研制了用于Si3N4陶瓷与因瓦合金的复合钎料，研究了TiNp含量对接头组织和力学性能的影响。焊接接头的典型组织为Si3N4/TiN+Ti2N+TiSi+Fe2Ti/Ag(s.s)+Cu(s.s)+TiNp/wavelike Fe2Ti+Ni3Ti/Ag-Cu共晶/因瓦合金。随着TiNp含量的增加，Si3N4附近的反应层变薄，陶瓷与波状金属间化合物之间的银铜共晶越来越少和细小。与未添加TiNp的情况相比，当TiNp的最佳含量为2%时，复合材料的最大剪切强度从63℃提高到229℃。通过纳米压痕对反应相的硬度和弹性模量进行了表征，揭示了焊缝处的强化效果。认为复合钎料的热膨胀系数(CTE)的降低、Si3N4/钎焊反应层的合适厚度、钎焊的强化是导致钎焊接头强化的原因。
Ag–Cu–Ti+TiNp composite filler was developed to braze Si3N4ceramic to Invar alloy, and subsequently the effect of TiNp content on the microstructure and mechanical properties of the joints was investigated. The typical microstructure of the brazed joints is Si3N4/TiN+Ti2N+TiSi+Fe2Ti/Ag(s.s)+Cu(s.s)+TiNp/wavelike Fe2Ti+Ni3Ti/Ag–Cu eutectic/Invar alloy. With the increase of TiNp content, the reaction layers near the Si3N4become thinner, and Ag–Cu eutectic appears less and finer between the ceramic and wavelike intermetallics. The maximum shear strength increases from 63 MPa to 229 MPa with the optimum TiNp content of 2 vol%, compared with the case without TiNp. The hardness and elastic modulus of the reaction phases were characterized by nanoindentation to reveal the strengthen of brazing seam. The following reasons are believed to strengthen the brazed joint: the thermal expansion coefficient (CTE) reduction of the composite filler, appropriate thickness of the Si3N4/braze reaction layer, the strengthen of the braze.
登录
查看更多内容
DOI：
10.1007/s100510050454
发表时间：
1998-10
期刊：
The European Physical Journal B - Condensed Matter and Complex Systems
影响因子：
--
作者：
E. Wassermann;B. Rellinghaus;T. Roessel;J. Kästner;W. Pepperhoff
通讯作者：
E. Wassermann;B. Rellinghaus;T. Roessel;J. Kästner;W. Pepperhoff
DOI：
10.1016/j.msea.2013.03.055
发表时间：
2013-07
影响因子：
6.4
作者：
Zhenwen Yang;L. X. Zhang;Ying Chen;J. Qi;P. He;Jiecai Feng
通讯作者：
Zhenwen Yang;L. X. Zhang;Ying Chen;J. Qi;P. He;Jiecai Feng
影响因子：
4.8
作者：
N. Tinsley;J. Huddleston;M. Lacey
通讯作者：
N. Tinsley;J. Huddleston;M. Lacey
影响因子：
6
作者：
N. Frage;L. Levin;E. Manor;R. Shneck;J. Zabicky
通讯作者：
N. Frage;L. Levin;E. Manor;R. Shneck;J. Zabicky
DOI：
10.1016/j.jmatprotec.2007.01.031
发表时间：
2007-07-06
影响因子：
6.3
作者：
Lin, Guobiao;Huang, Jihua;Zhang, Hong
通讯作者：
Zhang, Hong