Workshop: Opportunities and Research Needs of Adhesion Science and Technology; Stanford University, Stanford, CA; February 26-27, 1987

本提案描述了为期两天的粘附科学研讨会 由Gerald G.富勒， 斯坦福大学和Kashmiri L. IBM的米塔尔 Corporation. 它将于2月26日和27日举行， 1987年在斯坦福大学。 这次研讨会将作为一个论坛， 通过这些技术， 可以理解粘合和涂层性能。 受试者 事项将包含足够的技术部门，以使与会者 从学术研究和国家科学基金会评估最关键的 这一领域的未决问题以及 最有可能参与和支持。 发言人将 主要从工业实验室中选择， 还介绍了粘合技术的具体应用 讨论当前的理论和实验方法。 的 应用将包括来自微电子学的例子， 包括光电电路、大容量存储介质、复合材料 材料、摩擦学保护涂层。 的专题介绍和 每个讨论环节的摘要将于 研讨会记录。 该研讨会得到了一些NSF/ENG项目的支持， 包括热力学和传输现象，材料 工程与加工、摩擦学、固体与地质 力学 因此，最终的研讨会计划将反映 这些方案的利益。 (Note：研讨会的日期可能会推迟到 1987年5月或6月）。

This proposal describes a two day Workshop on Adhesion Science and Technology to be co-directed by Professor Gerald G. Fuller of Stanford University and Dr. Kashmiri L. Mittal of IBM corporation. It will be held on the 26th and 27th of February, 1987 at Stanford University. This workshop will serve as a forum through which the range of technologies which are impacted by adhesion and coating properties can be appreciated. The subject matter will contain sufficient technical dept ot enable attendees from academic research and NSF to assess the most critical outstanding issues in this field and the areas in which they could most likely particpate and support. The speakers will primarily be chosen from industrial laboratories and will introduce specific applications of adhesion technologies as well as discuss current theories and experimental methods. The applications will include examples from microelectronics, including optoelectric circuits, mass storage media, composite materials, tribology protective coatings. The presentations and summaries of each discussion session will be published in workshop proceedings. The workshop is supported by a number of NSF/ENG programs, including Thermodynamics and Transport Phenomena, Materials Engineering and Processing, Tribology, and Solid and Geo- mechanics. Therefore, the final workshop program will reflect the interests of these programs. (Note: The date of the workshop will probably be delayed until May or June, 1987).