International Workshop on Defect and Fault Tolerance in VLSI Systems; October 6-7, 1988; Springfield, Massachusetts

研讨会讨论了复杂VLSI(超大规模集成)和WSI(晶片规模集成)系统中的缺陷容错和容错问题。它的目标是将上述问题领域的研究人员和设计师与适当的计算机辅助设计(CAD)工具和创新包装技术的开发人员聚集在一起。其范围包括(A)缺陷和容错计算机体系结构；(B)缺陷和容错存储器；(C)成品率增强技术；(D)故障模型和缺陷模型；(E)缺陷和成品率的统计建模；(F)修复和重组技术；(G)WSI和3-D VLSI电路的封装技术；(H)高密度混合电路；(I)计算机辅助设计工具；和(J)实验系统。这项研究将汇集美国和国外产业界和学术界的研究人员和实践者，讨论制造缺陷、成品率模型和提高成品率的芯片设计等问题。它将促进产业界和学术界在了解制造缺陷和开发缺陷容错和容错技术和系统方面更好的互动。项目委员会由学术界和工业界的杰出研究人员组成。讲习班组织者在这一领域进行了广泛的研究，并在讲习班所处理的问题领域受到尊重。这笔由国家科学基金会资助的赠款将用于资助一位主旨演讲者的旅费和会议与会者的会议记录印刷费。如果没有NSF的支持，对于参加研讨会的人数有限的人来说，注册成本将非常高。因此，强烈建议提供支持。

The workshop addresses problems on defect tolerance and fault tolerance in complex VLSI (Very Large Scale Integration) and WSI (Wafer Scale Integration) systems. Its objective is to bring together researchers and designers in the above problem areas with developers of appropriate computer-aided design (CAD) tools and innovative packaging techniques. Its scope includes (a) defect and fault tolerant computer architectures; (b) defect and fault tolerant memories; (c) techniques for yield enhancements; (d) fault models and defect models; (e) statistical modeling of defects and yield; (f) repair and restructuring techniques; (g) packaging technologies for WSI and 3-D VLSI circuits; (h) high density hybrid circuits; (i) CAD tools; and (j) experimental systems. The research will bring together researchers and practitioners in both industry and academia in the U.S. and abroad to discuss problems on fabrication defects, yield models, and chip designs for yield enhancement. It will foster better interactions between industry and academia in understanding fabrication defects and developing defect tolerant and fault tolerant techniques and systems. The program committee consists of distinguished researchers in academia and industry. The workshop organizers have done extensive research in this area and are well respected in the problem areas addressed by the workshop. The grant funded by the National Science Foundation will be used to support travel for a keynote speaker and the printing cost of proceedings for conference attendees. Without the support from NSF, the cost of registration will be exceedingly high for the limited number of workshop attendees. Support is, therefore, highly recommended.