Heat Transfer Analysis of Transient Thermal Processing of Multilayer Thin Film Structures

瞬变热处理是电子器件多层膜制备过程中必不可少的一步。目前热加工技术的主要障碍是材料缺陷，如翘曲和滑移，这是由于薄膜结构中的温度梯度引起的热应力造成的。在拟议的研究中，将开发一种数值技术来预测多层薄膜结构在热加工过程中的所有时间的温度分布。这项技术将模拟具有不同光学和热学性质的薄膜的复杂几何形状，将允许相变，并将包括固定和可变热源。后续的参数研究将集中在两种新兴的瞬变热处理技术，区域熔化再结晶(ZMR)和快速热退火(RTA)，这两种技术迫切需要热分析。这项技术将在薄膜结构的“大比例”模型上进行实验测试。

Transient thermal processing is an essential step in multilayer thin film fabrication for electronic devices. Major hurdles in current thermal processing techniques are the material defects, such as warpage and slip, caused by thermal stresses due to temperature gradients in the thin-film structures. During the proposed investigation, a numerical technique will be developed to predict the temperature distribution in a multilayer thin film structure at all times during thermal processing. The technique will simulate complex geometries of films with variable optical and thermal properties, will allow for phase change, and will include stationary and variable heat sources. Parametric study following the development will focus on two emerging transient thermal processing technologies, Zone Melting Recrystallization (ZMR) and Rapid Thermal Annealing (RTA), where there is immediate need for thermal analysis. The technique will be tested experimentally on "large scale" models of the thin film structure.