Integration of Micromechanical and Vacuum Microelectronic Devices

本研究将探讨 结合真空的可行性 微电子和 微机电装置 在同一个硅片上。 具体而言，它将审查 使用真空的可行性 微电子驱动硅 微型马达 的科技 可以在此资助下开发 也可以应用于以下组合： 电子和微传感器 能够承受严酷的 环境-高温，高 核辐射通量 在一个芯片上。 主要 本研究的目的是 比较技术选项 适用于两种真空 微电子和 微机电装置， 选择一个兼容的设置，设计 硅微电机兼容 带有真空微电子驱动器的 电路，并开始开始制造 的设计。

This research will examine the feasibility of combining vacuum microelectronics and microelectromechanical devices together on the same silicon chip. Specifically, it will examine the feasibility of using vacuum microelectronics to drive a silicon micromotor. The technologies that could be developed under this grant could also apply to combination of electronics and micro-sensors capable of withstanding harsh environments-high temperature, high nuclear irradiation flux--together on a single chip. The major objectives of this research are to compare technology options available for both vacuum microelectronics and microelectromechanical devices, to select a compatible set, to design a silicon micromotor compatible with vacuum microelectronic drive circuits, and to begin fabrication of the design.