RIA: Electromagnetic Modeling of Interconnections in High Speed Digital Integrated Circuits

这项研究是关于数字电路上互连的电气性能的精确模型。保持信号通过各种互连传播时的保真度是集成电路(IC)正常运行的关键因素。对于非常高速的集成电路，信号传播具有复杂的电磁特性。很难获得复杂互连结构的准确模型。在正在开发的模型中，信号通过互连传输的瞬时响应由麦克斯韦方程的三维、全波、在时间域中的有限差分解表示。这种解决方案正在开发中，以符合多层集成电路中的互连几何结构。正在关注激励和吸收边界条件，以确保高度的数值精度。正在分析各种互连结构，特别考虑不同角度的弯头(同一层上的连接)和不同几何形状的过孔(相邻层之间的连接)。

This research is on accurate models of the electrical performance of interconnections on digital circuits. Maintenance of the fidelity of a signal as it propagates through various interconnections is a key factor in proper functioning of integrated circuits (IC's). For very high-speed IC's, there is a complicated electromagnetic nature of the signal propagation. Accurate models of the complex interconnection structures are difficult to obtain. In the model being developed transient responses of signal propagation through interconnections are represented by the three-dimensional, full-wave, finite difference solution of Maxwell's equations in the time domain. This solution is being developed to conform to the interconnection geometries found in multilayer IC's. Attention is being paid to excitation and absorbing boundary conditions to ensure a high degree of numerical accuracy. Various interconnection structures are being analyzed, with special consideration being given to bends of different angles (connections on the same layer) and vias of different geometries (connections between adjacent layers).