ENGINEERING RESEARCH EQUIPMENT: Equipment Dedicated to Research in the Engineering of Hybrid Optoelectronic Devices and Components

购买该设备将专门用于混合光电组件的工程研究，用于插入到3D光学图像处理架构中。三个综合研究项目将利用研究设备实现基于休斯3D计算机体系结构的紧凑型、高通量光学图像处理模块。这种电子处理器由成堆的硅片组成，通过欧姆接触相互连接。功耗限制了处理速度。PI建议用基于超大规模集成电路的高能效光学互连取代电子触点。超大规模集成电路光学互连器件的制作及其在多芯片模块中的对准是提高3D计算机计算能力的关键技术。根据这项研究计划购买的设备包括计算机工作站、信号源发生器和频谱分析仪，用于设计、布局和测试VLSI器件。光互连是通过在VLSI芯片中填充电光材料来实现的。完成这项任务所需的设备包括真空炉、电热板、温度控制器、真空旋转器和净水系统。将光学互连器件对准多芯片模块需要真空蒸发器和无助焊剂回流装置。测试多芯片模块以插入休斯3D计算机体系结构需要可见激光器、相关光学硬件、浮动台和支腿。

The purchase of this equipment will be dedicated to the research in the engineering of hybrid optoelectronic components for insertion into 3D optical image processing architectures. Three integrated research projects will utilize the research equipment to realize a compact, high throughput optical image processing module, based on the Hughes 3D computer architecture. This electronic processor consists of stacks of silicon wafers interconnected through ohmic contacts. Power dissipation limits the processing speed. The PI proposes to replace the electronic contacts with power efficient VLSI-based optical interconnects. Fabrication of VLSI optical interconnect devices and their alignment into multi-chip modules are crucial technologies for increasing the computational power of 3D computers. Equipment to be purchased under this research project includes computer workstations, a source generator and spectrum analyzer for the design, layout and testing of VLSI devices. Optical interconnections are realized by filling the VLSI chips with electro-optic materials. Equipment required to accomplish this task includes vacuum ovens, hotplates, temperature controllers, vacuum spinner and water purification system. Aligning the optical interconnect devices into multi-chip modules requires vacuum evaporators and a fluxless solder reflow unit. Testing the multi-chip modules for insertion into the Hughes 3D computer architecture requires a visible laser, associated optical hardware, floatation table and legs.