SBIR Phase II: Augmented Hydrostatic Extrusion for Ultrafine Bonding Wire

这个SBIR二期项目解决了一个改进的、增强的流体静压挤压工艺，用于生产非常细的线材。这种线在微芯片中用作键合线。随着现代微电子技术的发展，对细径金铝线的需求不断增加。在制造非常细的金属丝时，在速度、每质量的减量和新兴金属丝的细度上存在着严格的限制。在第一阶段的研究中，拉丝和增强静压挤压（hydraw）非常细的金属丝的工艺，从分析和实验两方面研究了这些限制的根本原因和性质。根据本研究制定的标准，设计了第二阶段的改进工艺。制作了0.5 mil （0.0125 mm）的线材，并在实验室设备上制作了实验量的线材并进行了测试。第二阶段的目标是生产0.5 mil黄金和铝线的水抽装置原型。该样机将用于研究线材产品的可靠性和质量以及改进后的水合概念的经济参数。

9321057 Simchon This SBIR Phase II project addresses a modified, augmented hydrostatic extrusion process for production of very fine wire. Such wire is used as bonding wire in microchips. With the advent of modern micro-electronics, the need for gold and aluminum wire of fine diameter has continuously increased. In the fabrication of very fine wire, severe limits exist on the speed, reduction per mass, and thinness of the emerging wire. In the Phase I study of the processes of wire drawing and augmented hydrostatic extrusion (hydraw) of very fine wire, root causes and the nature of these limitations were studied, both analytically and experimentally. A modified process for Phase II was designed according to criteria developed in this study. Wire of 0.5 mil (0.0125 mm) was produced, and experimental quantities of wire were made on laboratory equipment and tested. The Phase II goal is a production prototype hydraw unit for 0.5 mil gold and aluminum wire. The prototype machine will be used to study the reliability and quality of the wire product and economic parameters of the modified hydraw concept.