Optical Systems and Optoelectronic Packaging Based on Batch-Processed Microactuated Technologies

9419112刘一个革命性的，但实际的，光电封装的方法，放弃了传统的方法的基础上永久，精确放置的光学组件内的模块将被调查。 在新方法中，微致动器被包括在自适应封装模块内，以提供光学元件对准的持续优化。 反馈到微致动器的控制信号是通过监测系统的一个或多个关键性能参数而得到的。 除了这种设计的明显好处之外，这种新方法实际上降低了制造成本，因为它通过批量制造过程取代了现在在制造车间单独对每个模块执行的主动监测/对准过程（通常是手动的）。 高性能模块所需的精确对准将在电子伺服控制下在现场自动完成。 这项工作代表了加州大学伯克利分校光电组和传感器与致动器组的共同努力。 本计画的目标为：（1）发展矽表面微机械加工技术，以制造具有适应性光电封装所需之运动范围、精确度及光学特性的对准结构;（2）严格测试这些结构的光学特性、机械完整性及环境稳定性;（3）演示一个简单的光电模块，特别是尾纤激光模块，作为研究与自适应封装有关的问题的工具;（4）演示高性能、高功能的光学子系统，即连续可调谐窄线宽外腔二极管激光器，用于研究自适应光电封装的最终潜力和极限。 这项技术的成功开发将大大降低复杂和高功能的光电元件和子系统的生产成本，目前只能作为高成本，有时是实验室限制，台式仪器。 为了使光学和光电系统对通信和计算基础设施产生广泛而持久的影响，这一发展至关重要。 ***

9419112 Lau A revolutionary, yet practical, approach to optoelectronic packaging which abandons traditional methods based upon permanent, precise placement of optical components inside the module will be investigated. In the new approach, microactuators are included inside the adaptively-packaged module to provide for continuous optimization of the alignment of optical components. The control signals fed back to the microactuators are derived from monitoring one or more key performance parameters of the system. In addition to the obvious benefit of this design, this new approach actually reduces the manufacturing cost because it replaces the active monitoring/alignment procedure now performed on each module individually on the manufacturing floor (often manually), by batch-manufacturing procedures. The precise alignment needed for high-performance modules will be accomplished automatically in the field under electronic servo control. The work represents a joint effort between the optoelectronics group and the sensors and actuators group at the University of California at Berkeley. The goals of this projects are: (1) development of silicon surface-micromachined technology for fabrication of alignment structures which possess the motion range, accuracy, and optical properties needed for adaptive optoelectronic packaging; (2) rigorous testing of these structures in regard to their optical properties, mechanical integrity, and environmental robustness; (3) demonstration of a simple optoelectronic module, specifically a pigtailed laser module, as a tool investigate issues related to adaptive packaging; (4) demonstration of high-performance, high-functionality optical subsystem, namely, a continuously-tunable narrow -linewidth external-cavity diode-laser, for investigation of the ultimate potential and limits of adaptive optoelectronic packaging. Successful development of this technology will lead to a great reduction in production costs of sophisticated and high-functionality optoelect ronic components and subsystems, presently available only as high cost, and sometimes laboratory-bound, bench-top instruments. This development is essential in order for optical and optoelectronic systems to make wide and lasting impact on the communication and computing infrastructures. ***