Management of Technological Innovation: Hierarchical Decision-Making in Life-Cycle Processing and Planning for Computer and Electronic Products

最近，越来越严格的政府立法和日益增长的“绿色”产品特性的消费主义趋势促使制造商考虑采取积极主动的方法，以尽量减少其产品和工艺对环境的影响。通过溶剂替代和包装材料的选择，计算机和电子产品制造商一直在引领这种范式转变。然而，这些努力主要是通过不协调的地方努力进行的，只有有限的转变为全公司的环境战略。本文提出了计算机和电子产品制造的分层决策的多学科综合分析。这个分析中的一个关键问题是开发过程、产品规划和公司层面的衡量环境绩效的指标。在工艺层面，将开发分析模型，以评估金属成型、注塑成型、板装配、底盘装配、拆卸和再研磨操作的废水、能源利用、生产率和质量之间的权衡。过程模型和指标可以结合起来评估可选择的制造/回收路径，以及材料选择和几何特征的变化。最后，使用工程数据，将探讨环境绩效的整体组织指标的发展。本研究亦将探讨垂直整合对分散制造和回收中供应商环境绩效的影响。分析模型将由我们的工业合作伙伴Sun Microsystems Inc.和Hughes Aircraft Company的生产基地以及他们的制造和回收供应商的现场研究来补充。在工程学院、哈斯工商管理学院和公共卫生学院，将通过对工业产品进行现场案例研究和编写课程材料来部署研究。

Proposal# 9421194 University of California at Berkeley The recent trend of more stringent government legislation and growing consumerism for "green" product features have driven manufactures to consider a proactive approach towards minimizing the environmental impact of their products and processes. Computer and electronics manufactures have been leading this paradigm shift through efforts in solvent substitution and selections of packaging materials. However, these efforts have occurred largely through uncoordinated local efforts, with only limited transformation into corporate wide environmental strategies. This proposal presents an multi-disciplinary, integrated analysis of hierarchical decision-making for the manufacture of computer and electronics products. A key issue in this analysis is the development of process, product planning and firm level metrics for measuring environmental performance. At the process level, analytical models will be developed to evaluate trade-off between effluents, energy utilization, production rate and quality for metal forming, interjection molding, board assembly, chassis assembly, disassembly and regrind operations. The process models and metrics can be combined to evaluate alternative manufacturing / recycling paths, as well as changes in material selection and geometric features. Finally, using engineering data, the development of overall organizational metrics for environmental performance will be explored. The proposed research will also examine the impact of vertical integration and influence on vendor environmental performance in decentralized manufacturing and recycling. The analytical modeling will be complemented by field studies at production sites of our industrial partners, Sun Microsystems Inc. and Hughes Aircraft Company, as well as sites of their manufacturing and recycling vendors. Deployment of research will occur through both on-site case studies of industrial products and creation of curriculum material in the College of Engi neering, Haas School of Business Administration and the School of Public Health.