Japan JSPS Program: Surface Chemistry Relevant to Copper Chemical Vapor Deposition

小行星9503889 该奖项支持克雷格廷德尔博士为期一年的日本科学促进会博士后奖学金。 本次研究将在东北大学材料研究所樱井俊夫教授的实验室进行。 拟议的工作包括硅和二氧化硅表面上的铜化合物的基础研究。 这些材料之所以令人感兴趣，是因为对其化学性质的更多了解将有助于创建可用于制造更快集成电路的工艺。 作为IMR的博士后研究员，Tindall博士将有机会熟悉樱井教授小组开发的一些非常强大的实验设备。 由于这种设备在其他实验室不容易获得，樱井教授的实验室将提供一个极好的环境来进行这项研究。 此外，东北大学的电子通信研究所也是一个非常受重视的机构，在该研究金的第二年可能提供一个机会，进行一些关于在硅和二氧化硅上沉积铜层的研究。 ***

9503889 Tindall This award supports a one year Japan Society for the Promotion of Science postdoctoral fellowship for Dr. Craig Tindall. The research work conducted for this fellowship will be performed in Professor Toshio Sakurai's laboratory at the Institute for Materials Research (IMR) at Tohoku University. The proposed work consists of fundamental studies of copper compounds on silicon and silicon dioxide surfaces. These materials are of interest because more knowledge of their chemistry will help to create processes which may be used to make faster integrated circuits. As a postdoctoral fellow at IMR, Dr. Tindall will have the opportunity to become familiar with some very powerful experimental apparatus which has been developed by Professor Sakurai's group. Since this equipment is not readily available in other laboratories, Professor Sakurai's laboratory will provide an excellent environment in which to perform this research. In addition, the Electro- Communication Institute at Tohoku University is also a very highly regarded facility, and may provide an opportunity in the second year of this fellowship to carry out some studies of deposition of copper layers on silicon and silicon dioxide. ***