SBIR PHASE I: Integrated Motoring and Magnetic Suspension System

这个小型企业创新研究(SBIR)第一阶段项目将探索使用先进的电磁悬浮和驱动技术来改进快速热处理(RTP)过程中的硅片处理。当前的晶圆RTP加工因晶圆丢失和因滚珠轴承故障和磨损而导致的设施停机而产生大量成本。除了改进的RTP设备外，晶圆加工设备制造商还需要先进的设备，这将使滚动元件轴承技术过时。预计将在更高的转速和更大直径的晶片方面取得进展。磁悬浮和驱动技术在RTP中使用的高温腐蚀性气氛(氟、氯、HCl)中支撑和旋转晶片看起来很有前途。第一阶段将结合设计、分析、原型测试和成本/性能权衡，以论证可行性，并为RTP设施的集成电机和磁悬浮系统(IMMSS)提供具有成本竞争力的概念设计。原型将在第二阶段进行评估。磁悬浮和驱动技术最终适用于集成电路制造中的各种材料处理问题，这些问题需要精确定位；没有粘滞；没有磨粒产生；以及暴露在真空、腐蚀或高温环境中。

This Small Business Innovation Research (SBIR) Phase I project will explore the use of advanced electromagnetic suspension and actuation technology to improve silicon wafer handling during Rapid Thermal Processing (RTP). Current wafer RTP processing incurs substantial cost from lost wafers and facility downtime due to ball bearing failure and wear. In addition to improved RTP equipment, manufacturers of wafer processing equipment need advanced facilities, which will make rolling element bearing technology obsolescent. Advances are expected in higher rotation rates and larger diameter wafers. Magnetic suspension and actuation technology looks promising for supporting and rotating a wafer in the high temperature corrosive atmosphere (fluorine, chlorine, HCl) used in RTP. Phase I will combine design, analysis, prototype testing, and cost/per-formance trade-offs to demonstrate feasibility and to produce a cost competitive conceptual design for an integrated motoring and magnetic suspension system (IMMSS) for RTP facilities. A prototype would be evaluated Phase II. Magnetic suspension and actuation technology is ultimately applicable to a wide range of material handling problems in integrated circuit manufacture which require precise positioning; the absence of stiction; the absence of wear particle generation; and exposure to vacuum, corrosive, or high temperature environments.