GOALI/IUCP: Testing and Constitutive Modeling of Joining Materials for Design and Reliability in Electronic Packaging

小行星9812696 这个赠款机会学术联络与工业（GOALI）研究项目是一个创新的模型和测试设备的电子封装工作的延续。在实验室试验、本构模型和计算机分析的集成方面将有几个新的发展方向。已经开发出一种新的热机械激光干涉测量装置，并将进行一系列测试，以获得有关循环机械和热载荷变化对连接材料（包括无铅材料）影响的信息。这种材料的热机械行为将被纳入统一的本构建模方法，使用扰动状态的概念（DSC）。 初步的工作已经证明了该模型的有效性，简单的应用程序对各种焊料和硅。该研究项目将集中在表征建模和测试的集成，以允许未来的设计和可靠性分析方法的优化。 该项目解决了更好地了解电子封装可靠性及其对微电子工业影响的重要需求。

9812696 Desai This Grant Opportunities for Academic Liaison with Industry (GOALI) research project is the continuation of work on an innovative model and test device for electronic packaging. Several new directions will be undertaken in the integration of laboratory testing, constitutive modeling and computer analysis. A new thermomechanical laser interferometry device has been developed and a series of tests will be performed to gain information on the effects on joining materials, including lead-free materials, of variations in cyclic mechanical and thermal loading. This thermomechanical behavior of the material will be incorporated into the unified constitutive modeling approach using the disturbed state concept (DSC). The preliminary work has demonstrated the validity of the model for simple applications on various solders and silicon. This research project will focus upon characterizing the integration of the modeling and testing to permit future optimization of design and reliability analysis methodology. This project addresses the significant need of having a better understanding of reliability in electronic packaging and the impact upon the microelectronics industry.