SBIR Phase I: Simulation of Rapid Thermal Processing in a Distributed Computing Environment

9860814 这个小企业创新研究第一阶段项目提出开发和演示一个计算工具，用于在分布式计算环境中详细模拟快速热处理（RTP）。RTP技术已成为制造先进半导体器件的关键技术。随着晶片尺寸越来越大，芯片尺寸越来越小，通过使用高性能计算的数值模拟来理解高度耦合的物理学，如辐射传热，瞬态流体流动和传热以及化学反应，是RTP反应器设计，优化和控制的关键。在第一阶段，将开发一个新的辐射模型，以考虑具有任何辐射复杂程度的表面辐射。图案化晶片的微尺度辐射特性将由微观模型预测。瞬态流体流动，传热和化学反应方程，然后使用非结构化有限体积法求解。并行化的主要手段是使用递归坐标二分法（Recursive Coordinate Bisection，RCM）将计算域分解为分布在计算机网络中的子域。计算机之间的消息传递将通过并行虚拟机（PVM）库提供。第一阶段将证明所提出的模拟工具在二维问题上的可行性。在第二阶段，该工具将被扩展到考虑其他一些物理和动态负载平衡策略的计算机网络上也将实施。 建议的模拟工具将显着有利于半导体制造设备行业，这需要详细了解多模和高度耦合的传输现象。潜在的应用包括RTP反应器和许多其他制造和材料处理系统的设计，优化和控制。

9860814 This Small Business Innovation Research Phase I project proposes to develop and demonstrate a computational tool for detailed simulation of Rapid thermal processing (RTP) in a distributed computing environment. RTP has become a key technology in the fabrication of advanced semiconductor devices. As wafers get larger and chip dimensions smaller, the understanding of the highly coupled physics such as radiative heat transfer, transient fluid flow and heat transfer as well as chemical reactions through numerical modeling using high-performance computing is the key to the design, optimization, and control of RTP reactors. In Phase I, a novel radiation model will be developed to take into account surface radiation with any level of radiative complexity. The microscale radiative properties of patterned wafers will be predicted by a microscopic model. The transient fluid flow, heat transfer, and chemical reaction equations are then solved using an unstructured finite volume method. The main vehicle for parallelism is to use a Recursive Coordinate Bisection (RCM) method to decompose the computational domain into sub-domains, which are distributed among a network of computers. Message passing among the computers will be provided through the Parallel Virtual Machine (PVM) library. The Phase I will demonstrate the feasibility of the proposed simulation tool on two-dimensional problems. In Phase II, the tool will be extended to consider some other physics and dynamic load balancing strategy on a network of computers will also be implemented. The proposed simulation tool will significantly benefit the semiconductor manufacturing equipment industries, which require a detailed understanding of multimode and highly coupled transport phenomena. The potential applications include the design, optimization, and control of RTP reactors and many other manufacturing and materials processing systems.