SBIR Phase II: Simulation of Rapid Thermal Processing in a Distributed Computing Environment

SBIR 第二阶段：分布式计算环境中的快速热处理仿真

• 批准号: 0078608
• 负责人: Jiwen Liu
• 金额: $ 39.96万
• 依托单位: ENGINEERING SCIENCES, INC.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-12-01 至 2002-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0078608&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Simulation; Rapid

This Small Business Innovation Research (SBIR) Phase II project will continue to develop and demonstrate a computational tool for detailed simulation of Rapid thermal processing (RTP) in a distributed computingenvironment by taking advantages of the findings in Phase I. RTP has become a key technology in thefabrication of advanced semiconductor devices. As wafers get larger and chip dimensions smaller, theunderstanding of the highly coupled physics such as radiative heat transfer, transient fluid flow and heattransfer as well as chemical reactions through numerical modeling using high-performance computing isthe key to the design, optimization, and control of RTP reactors. In Phase II, A 3D surface radiationmodel based on the modified discrete transfer method (MDTM) will be developed to treat radiativetransfer in the lamphouse and process chamber as a whole process. The detailed pattern effects will betaken into account by rigorously solving time-domain Maxwell's equations through a finite volumeapproach. The rarefied gas dynamics in low pressure RTP will be modeled by adding Burnett terms intothe Navier-Stokes equations. The governing equations that contain various multi-disciplinary physicalmodels will be solved by a 3D unstructured finite volume method. To address computationally intensive3D simulation needs, an efficient parallel strategy will be implemented in the solution procedure. Datacommunication among parallel processors will be conducted by the Message Passing Interface (MPI)library. To accelerate the overall solution convergence and improve the parallel performance, thealgebraic multi-grid (AMG) method will be used to solve the discretized equations in each processor. It isexpected that the proposed simulation tool can be used to systematically investigate the underlyingphysics occurring in RTP systems, and to help in the design, optimization, and control of RTP reactors.The proposed simulation tool will significantly benefit the semiconductor manufacturing equipment industries that require a detailed understanding of multimode and highly coupled transport phenomena. The potential applications include the design, optimization, and control of RTP reactors and many other manufacturing and materials processing systems.

这个小企业创新研究（SBIR）第二阶段项目将继续开发和演示一个计算工具，用于在分布式计算环境中详细模拟快速热加工（RTP），利用第一阶段的发现。RTP已经成为制造先进半导体器件的关键技术。随着晶圆越来越大，芯片尺寸越来越小，通过高性能计算数值模拟对辐射传热、瞬态流体流动和传热以及化学反应等高耦合物理特性的理解是RTP反应器设计、优化和控制的关键。在第二阶段，将建立基于改进离散传递方法（MDTM）的三维表面辐射模型，将灯箱和工艺室中的辐射传递作为一个整体过程进行处理。通过有限体积法严格求解时域麦克斯韦方程组来考虑详细的模式效应。通过在Navier-Stokes方程中加入Burnett项来模拟低压RTP中的稀薄气体动力学。将采用三维非结构有限体积法求解包含多种多学科物理模型的控制方程。为了解决计算密集型3d仿真需求，将在求解过程中实施有效的并行策略。并行处理器之间的数据通信将由消息传递接口（Message Passing Interface， MPI）库进行。为了加快整体解的收敛速度和提高并行性能，将使用代数多网格（AMG）方法在每个处理器中求解离散方程。预计所提出的仿真工具可用于系统地研究RTP系统中发生的潜在物理现象，并有助于RTP反应堆的设计、优化和控制。所提出的仿真工具将大大有利于半导体制造设备行业，需要详细了解多模和高耦合输运现象。潜在的应用包括RTP反应器和许多其他制造和材料处理系统的设计、优化和控制。