Additive Patterning of Integrated Functional Materials on a Chip

Nancy R.Sottos和David A.Payne，伊利诺伊大学香槟分校Proposal编号#0088206芯片上集成功能材料的附加图案化对于芯片上微系统未来工程的关键问题是在复杂的集成系统中快速绘制不同材料的图案的能力。提出了一种新的、添加的图案化方法，该方法将能够集成功能材料(例如，电气、机械、光学等)。在芯片上，而不是作为离散组件添加到电路和系统中。具体地说，计划进行一项跨学科的调查，以检查集成电子陶瓷薄膜器件的添加图案化，并更好地了解在此过程中薄膜中复杂的残余应力发展。电陶瓷薄膜的集成是实现微型化传感器和执行器、超声波电机和光学元件以及集成电路中的非易失性存储元件和开关电容器等未来微电子机械(MEM)器件应用的关键技术。为了将这项技术推广到下一代机电设备，有必要从根本上了解在构图过程中在薄膜中产生的残余应力、这些应力对薄膜性能的影响以及如何调整这些应力以实现最佳的器件性能。这项跨学科研究的具体目标包括：(1)开发新的协议，以形成更厚的电陶瓷膜和多层器件，其中最关键的是残余应力，(2)在构图过程中原位测量残余应力的发展，(3)开发分析模型，以了解衬底、薄膜附着力和工艺条件对残余应力的作用，(4)表征图案化薄膜的机电特性和评估残余应力对性能的影响，(5)开发调整残余应力状态的策略，以实现器件的最佳性能和可靠性。

Nancy R. Sottos and David A. Payne, University of Illinois at Urbana-ChampaignProposal Number #0088206Additive Patterning of Integrated Functional Materials on a Chip A critical issue for the future engineering of microsystems on a chip is the ability to rapidly pattern dissimilar materials in complex integrated systems. A novel, additive method of patterning is proposed that will enable integration of functional materials (e.g., electrical, mechanical, optical, etc.) on a chip, rather than as a discrete component added into the circuit and system. Specifically, an interdisciplinary investigation is planned to examine additive patterning of integrated electroceramic thin film devices and to develop a better understanding of the complex residual stress development in the films during this process. Integration of electroceramic thin films is a key technology for the realization of future micro electromechanical (MEM) device applications such as miniaturized sensors and actuators, ultrasonic motors and optical elements as well as nonvolatile memory elements and switching capacitors for integrated circuitry. In order to advance this technology for the next generation of electromechanical devices, it is essential to develop a fundamental understanding of the residual stresses generated in the films during patterning, the effects of these stresses on film properties and how to tailor these stresses for optimal device performance. Specific goals of this interdisciplinary investigation include: (i) development of new protocols to pattern thicker electroceramic films and multilayer devices where residual stresses are most critical, (ii) in-situ measurement of residual stress development during patterning, (iii) development of analytical models to understand the role of the substrate, film adhesion, and processing conditions on residual stress, (iv) characterization of the electromechanical properties of patterned films and assess the effects of residual stress on performance, and (v) development of a strategy for tailoring the residual stress state for optimal performance and reliability of the device.