Ultra-High-Capacity Optical Communications and Networking: Optoelectronic Integrated Packaging Technology for High Date Rate Optical Communications

该提案是根据“超高容量光通信和网络”招标NSF 01-65提交的。先进的数据和电信通信系统将需要开发和集成各种硬件技术（例如光纤、集成光学、电子和MEMs），以实现可靠的功能，并满足大容量和高数据速率吞吐量。在过去，最好的设计在研究实验室中显示出巨大的希望，但一旦包装就会表现出降低的响应。光电器件的设计是复杂的，通过将电子设计从光学设计中分离出来，简化了器件的设计。在高数据速率下，未解决的电气问题可能导致显著的光学响应退化。在未来，机械和电气问题必须在器件和封装设计中联系在一起，以提供改进的封装器件性能，减少设计周期时间和成本。因此，50 Gbps以上的高数据速率系统的成功开发将需要开发在光电（OE）设计中提供透明封装集成的方法。发展以光学为中心的高速光电设计方法是高速光电设计的关键问题。鉴于目前高速电子设计的知识，这种协同设计方法现在是可能的。本研究旨在探讨“协同设计”方法的发展，以设计和集成高速电子互连到器件和光电子封装中。这项研究的影响可能会为光子技术提供革命性的封装设计方法，从而导致第一个“集成”光电封装设计技术的发展。在此研究期间寻求两个目标。目的1旨在研究光电器件高速高隔离电互连的设计。目的2旨在研究透明光电封装集成的协同设计方法的发展。围绕互连和封装两个主题，我们建议研究利用硅微加工技术作为载体，将光学微工作台封装技术与高性能互连设计相结合，形成新型高速集成封装。我们将通过以下研究问题来实现我们的目标：首先是用于将激光器封装到硅光学微台技术中的隔离和高密度设计的互连研究。二是用于光调制器应用的封装行波电极研究。三是硅微工作台技术在低温共烧陶瓷（LTCC）基板上的异质封装集成研究，以提供高频连接器与硅微工作台之间的信号传输。该研究项目将为培养下一代高频工程师在高数据速率电子接口光学协同设计方法方面提供重要的经验和知识。

This proposal was submitted in response to the solicitation NSF 01-65 on "Ultra-High Capacity Optical Communications and Networking." Advanced data and telecom communication systems will require development and integration of diverse hardware technologies (e.g. fiber optics, integrated optics, electronics, and MEMs) to achieve reliable functionality and to satisfy large capacity and high data rate throughput. In the past, the best designs have shown great promise in the research lab, but have demonstrated degraded response once packaged. Optoelectronic device design is complex and has been simplified by de-coupling the electronic design from the optical aspect of design. At high data rates, unresolved electrical issues can result in significant optical response degradation. In the future both mechanical and electrical issues must be linked together in device and package design to offer an improved performance of packaged devices with reduced design cycle time and cost. Hence, successful development of high data rate systems above 50 Gbps will require development of approaches to offer transparent package integration in optoelectronic (OE)design.A key issue for high-speed optoelectronic design is development of optics-centered electronic design methods. Such co-design methods are now possible, given the current knowledge in high-speed electronic design. This research seeks to investigate the development of "co-design" methods for the design and integration of high speed electronic interconnects into device and optoelectronic packages. The impact of this research could provide revolutionary package design methods for photonic technology that could lead to the development of the first "integrated" optoelectronic package design techniques. Two objectives are sought during this research period. Objective 1 seeks to investigate the design of high speed electrical interconnects with high isolation for optoelectronic devices. Objective 2 seeks to investigate the development of co-design approaches for transparent optoelectronic package integration. Focusing on two topics - interconnects and packaging, we propose to investigate the use of silicon micromachining techniques as a vehicle for combining optical microbench packaging technology with high performance interconnect design to form novel high speed integrated packages. We will achieve our objectives by working on the following research problems: The first is an interconnect study for isolated and high-density designs used to package lasers into the silicon optical microbench technology. The second is a packaged traveling wave electrode study for use in optical modulator applications. The third is integration study for heterogeneous packaging of Si microbench technology in low temperature co-fired ceramic (LTCC) substrate boards to provide signal transfer between high frequency connectors and the silicon micro-bench. This research project will provide important experience and knowledge for training the next generation of high frequency engineers in co-design methods for optics with high data rate electronic interfaces.