PECASE: Micromachined Microwave and Optical Integrated Circuits - Design Methodologies for High Performance Communication Circuits and Packages

9733963 Drayton在处理来自无线和多媒体服务的大型复杂数据格式的通信系统中，实现高频@设计变得越来越困难。这是由于有限的速度/带宽能力和串扰/抗干扰的电子设计。随着数据大小和结构的增加，通信系统必须更快地运行。更快的速度可以通过两种方式实现：(1)通过增加工作频率或(2)通过使用光子电路。提高电子系统的工作频率有一个性能上限，特别是在串扰和干扰方面。另一方面，光子电路可以实现更高的速度，因此更宽的带宽，并提供出色的串扰/干扰抗扰性。不幸的是，在使用光子器件的电信应用中，以非常快的速率传输不同的数据类型已经实现，但是这些设计类型并不容易用于微波应用。本提案将侧重于使用多学科方法开发高频电路的创新封装和电路设计方法。这种方法将涉及三个一般领域：(1)先进材料，如聚合物和M-V，(2)先进加工技术，如微加工，(3)微波和光集成电路的设计方法。总的来说，这些领域将用于解决新型高频电路设计和未来通信系统高频设计人员的研究和教育需求。本研究计划的目标是-探索使用新颖的光子设计来实现传统上由微波电路执行的功能；-利用聚合物和III-V材料，结合微机械加工技术，开发基于微波和光学集成电路的封装和电路；-开发封装和电路组件的方法；-开发电路元件，以实现系统级集成，-研究光子波如何与高频电子电路（微波）相互作用。教育计划的目标是-在传统的学习环境（即教室和实验室）中提供现代应用问题；-通过动手实验和课堂互动，在课堂环境中提供互动式学习方法；-运用多学科方法，解决经典及现代应用问题；-透过远程学习工具（即互联网和网上学习模块）提供最新的学习机会，再教育在职工程师和其他研究人员。该计划将影响高频应用新设计方法的发展。多学科的方法将允许在设计的开发阶段研究先进的材料和新的制造工艺，潜在地产生低成本的方法。此外，采用微波和光集成电路来实现微波功能将允许在混合信号平台中实现更灵活的设计方案。a - 1

9733963 Drayton High performance in communication systems that handle large complex data formats from wireless and multimedia services is becoming increasingly difficult to achieve high frequency @ designs. This is due to the limited speed/bandwidth capability and cross-talk/interference immunity of electronic designs. As data size and structure increase, communication systems must operate faster. Faster speeds can be achieved in two ways: (1) by increasing the operating frequency or (2) by using photonic circuits. Increasing the operating frequency of electronic systems has an upper performance limit, particularly in terms of cross-talk and interference. Photonic circuits, on the other hand, can achieve higher speeds hence wider bandwidth and offers excellent cross-talk/ interference immunity. Unfortunately, the delivery of disparate data types at very fast rates has been achieved in telecommunication applications using photonic devices, but these designs types are not readily available for microwave applications. This proposal will focus on developing innovative package and circuit design methodologies for HF circuits using a multidisciplinary approach. This approach will involve three general areas: (1) advanced materials, such as polymers and M-V's, (2) advanced processing techniques, such as micromachining, and (3) design methods for microwave and optical integrated circuits. Collectively, these areas will be used to address the research and educational needs for novel HF circuit designs and for HF designers of future communication systems. The goals of this research plan are - to explore the use of novel photonic designs to achieve functions traditionally performed by microwave circuits; - to use polymers and III-V materials with micromachining techniques to develop packages and circuits based on the microwave and optical integrated circuits; - to develop methodologies for packages and circuit components; - to develop circuit components implemented in silico n platform for system-level integration, - to study how photonic waves interact with high frequency electronic circuits (f microwaves) The goals of the education plan are - to offer modem applied problems into conventional learning environments (i.e. the classroom and laboratory); - to provide interactive learning methods in our classroom environment via hands-on laboratory and classroom interactions; - to use multi-disciplinary approaches to solve classical and modem applied problems; - to provide up-to-date learning opportunities through distance learning tools (i.e. internet and Web-based learning modules) to re-educate practicing engineers and other researchers in the field. This plan will impact the development of novel design methodologies for HF applications. The multi-disciplinary approach will allow advanced materials and novel fabrication processes to be investigated during the development states of design, potentially yielding low cost approaches. Furthermore, the implementation of microwave and optical integrated circuits to achieve microwave functionality will allow the realization of more flexible design schemes in mixed signal platforms. A-1