PECASE: Micromachined Microwave and Optical Integrated Circuits - Design Methodologies for High Performance Communication Circuits and Packages

PECASE：微机械微波和光学集成电路 - 高性能通信电路和封装的设计方法

• 批准号: 9733963
• 负责人: Rhonda Franklin
• 金额: $ 20万
• 依托单位: University of Illinois at Chicago
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1998
• 资助国家: 美国
• 起止时间: 1998-08-01 至 1998-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9733963&HistoricalAwards=false
• 关键词: PECASE; Micromachined; Microwave; Optical; Integrated

9733963 Drayton High performance in communication systems that handle large complex data formats from wireless and multimedia services is becoming increasingly difficult to achieve high frequency @ designs. This is due to the limited speed/bandwidth capability and cross-talk/interference immunity of electronic designs. As data size and structure increase, communication systems must operate faster. Faster speeds can be achieved in two ways: (1) by increasing the operating frequency or (2) by using photonic circuits. Increasing the operating frequency of electronic systems has an upper performance limit, particularly in terms of cross-talk and interference. Photonic circuits, on the other hand, can achieve higher speeds hence wider bandwidth and offers excellent cross-talk/ interference immunity. Unfortunately, the delivery of disparate data types at very fast rates has been achieved in telecommunication applications using photonic devices, but these designs types are not readily available for microwave applications. This proposal will focus on developing innovative package and circuit design methodologies for HF circuits using a multidisciplinary approach. This approach will involve three general areas: (1) advanced materials, such as polymers and M-V's, (2) advanced processing techniques, such as micromachining, and (3) design methods for microwave and optical integrated circuits. Collectively, these areas will be used to address the research and educational needs for novel HF circuit designs and for HF designers of future communication systems. The goals of this research plan are - to explore the use of novel photonic designs to achieve functions traditionally performed by microwave circuits; - to use polymers and III-V materials with micromachining techniques to develop packages and circuits based on the microwave and optical integrated circuits; - to develop methodologies for packages and circuit components; - to develop circuit components implemented in silico n platform for system-level integration, - to study how photonic waves interact with high frequency electronic circuits (f microwaves) The goals of the education plan are - to offer modem applied problems into conventional learning environments (i.e. the classroom and laboratory); - to provide interactive learning methods in our classroom environment via hands-on laboratory and classroom interactions; - to use multi-disciplinary approaches to solve classical and modem applied problems; - to provide up-to-date learning opportunities through distance learning tools (i.e. internet and Web-based learning modules) to re-educate practicing engineers and other researchers in the field. This plan will impact the development of novel design methodologies for HF applications. The multi-disciplinary approach will allow advanced materials and novel fabrication processes to be investigated during the development states of design, potentially yielding low cost approaches. Furthermore, the implementation of microwave and optical integrated circuits to achieve microwave functionality will allow the realization of more flexible design schemes in mixed signal platforms. A-1

在处理来自无线和多媒体服务的大型复杂数据格式的通信系统中，实现高频设计变得越来越困难。 这是由于有限的速度/带宽能力和电子设计的串扰/抗干扰性。 随着数据大小和结构的增加，通信系统必须更快地运行。 更快的速度可以通过两种方式实现：（1）通过增加工作频率或（2）通过使用光子电路。 提高电子系统的工作频率有一个性能上限，特别是在串扰和干扰方面。 另一方面，光子电路可以实现更高的速度，因此具有更宽的带宽，并提供出色的串扰/抗干扰性。 不幸的是，在使用光子器件的电信应用中已经实现了以非常快的速率传送不同的数据类型，但是这些设计类型不容易用于微波应用。 该提案将侧重于开发创新的封装和电路设计方法的高频电路使用多学科的方法。 这种方法将涉及三个一般领域：（1）先进材料，如聚合物和M-V的，（2）先进的加工技术，如微机械加工，和（3）微波和光学集成电路的设计方法。 总的来说，这些领域将用于解决新的高频电路设计和未来通信系统的高频设计师的研究和教育需求。 本研究计划的目标是 - 探索使用新颖的光子设计来实现传统上由微波电路执行的功能; - 利用聚合物和III-V族材料，结合微机械加工技术，开发基于微波和光学集成电路的封装和电路; - 开发封装和电路元件的方法; - 为了开发在用于系统级集成的硅平台中实现的电路组件， - 研究光子波如何与高频电子电路（f微波）相互作用 教育计划的目标是 - 在传统的学习环境（即教室和实验室）中提供现代应用问题; - 通过动手实验室和课堂互动，在我们的课堂环境中提供互动学习方法; - 运用多学科方法解决经典和现代应用问题; - 通过远程学习工具（即互联网和基于网络的学习模块）提供最新的学习机会，对该领域的执业工程师和其他研究人员进行再教育。 该计划将影响HF应用的新设计方法的发展。 多学科的方法将允许先进的材料和新的制造工艺在设计的发展阶段进行研究，可能产生低成本的方法。 此外，实现微波和光学集成电路以实现微波功能将允许在混合信号平台中实现更灵活的设计方案。 A-1