SBIR Phase I: Reactive Mounting of Heat Sinks

这个小企业创新研究（SBIR）第一阶段项目旨在开发一种快速的散热器安装技术，该技术可以在散热器和微电子设备之间产生金属键。金属键在热传导和机械强度方面远远优于目前的安装技术。提出的将散热器安装到基板和芯片上的技术是一种反应性连接工艺，该工艺使用反应性多层箔作为熔化焊料或钎焊的局部热源。这种薄膜是一种新型的纳米工程材料，它可以在室温下用火花点燃自传播放热反应。通过在两个焊料（或钎焊）层和两个组件之间插入多层箔，箔中反应产生的热量熔化焊料，从而粘合组件。这种新的焊接方法消除了对炉子的需要，并且加热非常局部，避免了对微电子设备的热损伤。由此产生的金属接头比普通的商业安装技术（润滑脂、垫片和环氧树脂）更坚固，导热性更好。反应键合过程也比大多数这些技术要快得多，大大节省了处理时间和便利性。第一阶段的研究将(1)证明这种安装过程的可行性，(2)表征所得界面的热学和机械性能，以及(3)开发一个模型，预测反应式安装过程中器件的热暴露。这种反应式安装技术的成功开发将促进微电子器件的热管理，并有助于加速这些器件性能的未来改进。热管理解决方案的全球市场规模约为37亿美元，其中大部分是外包市场。计算机行业的趋势是朝着更小、功耗更高的设备发展，这增加了对卓越热管理的需求。

This Small Business Innovation Research (SBIR) Phase I project seeks to develop a rapid, heat sink mounting technology that produces a metallic bond between the heat sink and the microelectronic device. The metallic bond is far superior to current mounting technologies in its thermal conduction and its mechanical strength. The proposed technology for mounting heat sinks onto substrates and chips is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders or brazes. The foils are a new class of nano-engineered materials, in which self- propagating exothermic reactions can be ignited at room temperature with a spark. By inserting a multilayer foil between two solder (or braze) layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace and, with very localized heating, avoids thermal damage to the microelectronic device. The resulting metallic joints are stronger and far more thermally conductive than common, commercial mounting technologies (greases, pads and epoxies). The reactive bonding process is also far more rapid than most of these technologies, offering substantial savings in processing time and convenience. Phase I research will (1) demonstrate the feasibility of this mounting process, (2) characterize the thermal and mechanical properties of the resulting interfaces, and (3) develop a model that predicts thermal exposure of devices during the reactive mounting process.Successful development of this reactive mounting technology will advance the thermal management of microelectronic devices, and it will help accelerate future improvements in the performance of these devices. The world wide market for thermal management solutions is about $3.7 billion, with most of this market being outsourced. The trends in the computer industry are towards smaller devices with higher power dissipation, increasing the need for superior thermal management.