Ion Driven Air Flow For Microscale Cooling Applications

集成电路技术继续朝着更高的器件密度以及随之而来的更高密度的废热的方向发展，为了将电子设备维持在期望的工作温度以下，必须去除更高密度的废热。在大多数应用中，包括个人计算机和工作站、移动电话、手持电子设备和汽车应用，经济和其他实际考虑因素将热管理解决方案限制在风冷系统。空气冷却技术通常是决定电子产品尺寸和性能的限制因素，因此迫切需要新的概念来提高空气冷却能力。拟议工作的目标是在微尺度上产生离子驱动的气流，集成在微特征的热产生表面中。这项工作的目的是通过开发一种本身真正处于微尺度的泵来填补微尺度对流冷却方面的技术空白。这项工作提出的关键进展是在空气中产生单极离子。单个离子物种可以在电场中加速，有效地产生流体运动。对离子驱动空气通过微通道泵送时所能达到的热传递速率的初步计算表明，这种技术有可能产生高达40W/cm2的散热。这种冷却速度与许多液体冷却应用中的冷却速度相比是有利的，并将提供一种空气冷却替代方案，以满足未来半导体器件的需求。资金由化学和运输系统司的热运输和热加工方案提供。

Integrated circuit technology continues to progress in the direction of higher device density and with it, a higher density of waste heat that must be removed in order to maintain the electronics below their desired operating temperatures. In the majority of applications, including personal computers and workstations, cellular phones, hand-held electronics, and automotive applications, economic and other practical considerations restrict thermal management solutions to air-cooled systems. Air cooling technology is often the limiting factor in determining the size and performance of electronic products, and novel concepts to improve air cooling capabilities are much needed.The goal of the proposed work is to produce ion driven air flow at the microscale, integrated within micro-featured heat generating surfaces. It is the aim of this work to fill a technological gap in microscale convective cooling by developing a pump that is itself truly at the microscale. The key advancement proposed in this work is the generation of unipolar ions in air. A single ion species can be accelerated in an electric field, efficiently creating fluid motion. Preliminary calculations of the heat transfer rates achievable using ion driven pumping of air through microchannels show that as much as 40 W/cm2 of heat rejection is possible by this technique. This cooling rate compares favorably to those in many liquid-cooled applications and would provide an air-cooling alternative to meet the needs of future semiconductor devices. Funding is being provided by the Thermal Transport and Thermal Processing Program of the Chemical and Transport Systems Division.