SBIR Phase I: Reactive Multilayer Joining of Metals and Ceramics

这个小型企业创新研究(SBIR)第一阶段项目将开发一种新的连接技术，该技术将为多种工业应用提供实质性的技术和成本优势，包括金属与金属和金属与陶瓷的连接。金属和陶瓷部件的连接技术是一种反应性连接过程，它使用反应性多层箔作为熔化焊料或铜焊的局部热源。铝箔是一种新型的纳米工程材料，它可以在室温下用火花点燃自蔓延放热反应。通过在两个焊料(或铜焊)层和两个部件之间插入多层箔，箔中的反应产生的热量融化了焊料，从而将部件粘合在一起。这种新的焊接方法消除了对炉子的需要，并且通过非常局部的加热，避免了对部件的热损害。这种反应粘接过程的商业潜力比大多数竞争技术更快，并产生坚固且成本效益高的接头。

This Small Business Innovation Research (SBIR) Phase I project will develop a new joining technology that will provide substantial technical and cost advantages for multiple industrial applications, including metal-to-metal and metal-to-ceramic joining. The technology for joining metallic and ceramic components is a reactive joining process that uses reactive multilayer foils as local heat sources for melting solders or brazes. The foils are a new class of nano-engineered materials, in which self-propagating exothermic reactions can be ignited at room temperature with a spark. By inserting a multilayer foil between two solder (or braze) layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. This new method of soldering eliminates the need for a furnace and, with very localized heating, avoids thermal damage to the components. The commercial potential of this reactive bonding process is more rapid than most competing technologies, and results in strong and cost-effective joints.