SBIR Phase II: Millimeter Wave Transceivers on Large Metamorphic Wafers

这个小型企业创新研究（SBIR）第二阶段项目将开发一个创新的低成本W波段（70-80 GHz）单芯片收发器，使用第一阶段开发的变形晶圆技术，并有效地集成各种MMIC组件。第一阶段开发的低成本非电子束FET工艺、MM HEMT和初始芯片设计将用于第二阶段的全集成收发器开发。由此产生的新技术将使毫米波行业具有成本效益，以扩大商业市场，实现行业所需的低成本和高性能。 该项目将实现汽车共谋避免雷达系统、毫米波跟踪系统以及安全雷达和检测系统的增强性能和低成本消费者兼容批量生产。

This Small Business Innovation Research (SBIR) Phase II project will develop an innovative low-cost W-band (70-80 GHz) single chip transceiver using the metamorphic wafer technology developed in Phase I, and efficiently integrating the various MMIC components. The low cost non-electronic beam FET processes, MM HEMTs, and initial chip designs developed in Phase I will be used for the development of the fully integrated transceiver in Phase II. The resulting new technology will enable the MMW industry to be cost effective to expand the commercial market to achieve the low cost and high performance required in the industry. This project will enable enhanced performance and low cost consumer compatible volume production of automotive collusion avoidance radar systems, MMW tracking systems, and security radar and detection systems.