SBIR Phase I: Athermal Multiplexers Based on Reflective Arrayed Waveguide Grating Devices

DMI-0339012这个小型企业创新研究第一阶段项目建议设计和演示一种基于现有阵列波导-光栅(AWG)器件的非热多路复用器。AWG是波分复用光网络中的关键器件。基于硅基二氧化硅技术的传统AWG的折射率随温度的变化导致峰值波长发生较大的漂移。这就需要使用热电制冷器以及温度传感和补偿电路。特别设计的外镜与反射型AWG(R-AWG)相结合，将用来补偿温度引起的折射率变化。反射镜组件的差热膨胀使其反射面随温度以恒定的速率旋转。反射式AWG-外镜组合还允许波长调整，将通道波长集中在ITU栅格上。反射镜的具体转速和设计将通过仿真和实验来确定。该项目的目标是制造一种高性能的40通道、100 GHz、温度不敏感的0-85℃范围内的无源AWG器件。这项工作希望显著提高基于密集波分复用的电信系统的性能。与传统的AWG相比，这些特性有望使本文提出的非热反射AWG更具吸引力和商业竞争力。新的方法应该消除复杂的封装和加工步骤，不需要电力和外部温度控制，从而产生更坚固、更易于使用和相当便宜的封装设备。

DMI-0339012This Small Business Innovation Research Phase I project proposes to design and demonstrate an athermal multiplexer based on an already existing arrayed waveguide-grating (AWG) device. AWGs are key components in wavelength division multiplexed optical networks. Temperature induced changes in the refractive index of conventional AWGs based on silica-on-silicon technology result in large shifts in the peak wavelength transmission. This necessitates the use of thermoelectric coolers and temperature sensing and compensating circuitry. A specially designed external mirror combined with a reflective AWG (R-AWG), will be used to compensate the temperature-induced index change. Differential thermal expansion of the mirror assembly rotates its reflecting surface at a constant rate with temperature. The reflective AWG-external mirror combination also allows for wavelength trimming that centers the channel wavelength at the ITU grid. The detailed rotation rate and design of the mirror will be determined by simulation and experiments. The goal of this project is to fabricate a high-performance 40-channel, 100 GHz, passive AWG device insensitive of temperature in the 0-85 degree C range. The work hopes to significantly improve the performance of DWDM-based telecommunication systems. These features hope to make the athermal reflective-AWGs proposed here attractive and commercially competitive when compared to conventional AWGs. The new approach should eliminate complex packaging and processing steps, the need for electric power and external temperature control, resulting in a more robust, easier to use, and considerably less expensive packaged device.