CAREER: Rapid Lateral Solidification in Thin Metallic Films: A New Route to Engineered Microstructures for Advanced Micro-Device Applications

快速横向凝固（RLS）是一种独特的新型激光熔化工艺，可以使介质/非晶基底上的金属薄膜快速凝固。它可以被视为“非常规”或“一体化”快速凝固，可以提供极高纯度和均匀性的快速凝固薄膜。这项拨款旨在完善和使用这项技术，对三种技术上有前景的铜基系统进行详细研究，并将相关的数值建模工作转化为匹兹堡大学材料科学与工程领域的综合计算机建模计划。实验工作：(1)在良好的控制条件下，利用激光熔化和RLS技术研究Cu、Cu- cr和Cu- sn薄膜的原位快速凝固过程（包括原位凝固速度测量，以及通过透射显微镜和扫描显微镜进行分析）；(2)吗?将金属快速凝固研究进一步扩展到非平衡状态，探索了Cu-Sn合金中非晶和玻璃形成的边界；(3)测量Cu和Cu- cr合金RLS显微组织的应用关键性能，包括电导率和电迁移；(4)使用数值模拟代码3DNS对实验进行建模，该代码将与MSE新的计算机建模教育计划相结合。该研究将为非平衡金属相、工程和复合微结构、形状记忆功能和非晶金属在薄膜先进器件中的应用开辟广阔的新领域，包括用于Cu和Cu合金互连的工程微结构、集成到传感器、MEMS和SAW器件中的形状记忆和金属玻璃合金，以及具有先进金属氧化物器件的新型金属基连接/电极。一项新的综合计算机建模计划将整合指导、支持和推广，以改变匹兹堡大学的MSE课程。另一个目标是招收研究生，提高本科生入学率，并通过与奥格斯堡大学交换项目和教师研究经验（RET）项目的学生交流来增加多样性。

Rapid lateral solidification (RLS) is a unique new laser-melting process that allows thin metallic films on dielectric/amorphous substrates to be rapidly solidified. It can be viewed as 'nonconventional' or 'integrated' rapid solidification that can provide rapidly solidified films of extremely high purity and uniformity. This grant aims to perfect and use this technique for a detailed study of three technically promising Cu-based systems, and to leverage related numerical modeling efforts into a comprehensive computer modeling initiative in Materials Science and Engineering at the University of Pittsburgh. The experimental effort: (1) investigates the rapid solidification process in-situ using laser melting and RLS of Cu, Cu-Cr and Cu-Sn thin films under well-controlled conditions (this includes in-situ measurements of solidification velocities, and analysis via transmission and scanning microscopy); (2)? extends metal rapid solidification research farther into non-equilibrium regimes, exploring the boundaries of amorphous and glass formation in Cu-Sn alloys; (3) measures application-critical properties on RLS microstructures of Cu and Cu-Cr alloys, including conductivity and electromigration; (4) models the experiments using the numerical simulation code 3DNS, which will be integrated with a new computer modeling education initiative in MSE. The research will open up a broad new arena for applications of non-equilibrium metallic phases, engineered and composite microstructures, shape memory functionality, and amorphous metals into thin-film advanced devices, including engineered microstructures for Cu and Cu-alloy interconnects, shape memory and metallic glass alloys integrated into sensors, MEMS, and SAW devices, and new metal-based connections/electrodes with advanced metal-oxide devices. A new comprehensive computer modeling initiative is planned that will integrate instruction, support, and outreach to transform the MSE curriculum at the University of Pittsburgh. Another goal recruits graduate students, boosts undergraduate enrollment, as well as increases diversity through student exchanges with the University of Augsburg exchange program and the Research Experience for Teachers (RET) program.