Control of the laser induced temperature field for the ralisation of a compact machining module for planar laser material processing

在小型化的过程中，金属微构件的工业化生产的重要性与日俱增。制造这种部件的机器的大小与部件的大小严重不成比例。可达到的精度受到机械定位元件的不精度以及振动和热变形等外部干扰的限制。激光化学去除能够使用相对较低的激光功率密度对金属进行非接触式加工。通过使用用于柔性光束整形的微镜阵列(DMD)，可以对工件进行二维加工。在激光材料加工中，DMD由于其较低的损伤阈值而尚未使用。该项目中使用的激光化学加工方法现在应该首次允许将DMD技术与基于激光的微加工相结合。本项目的目的是在已实现的实验室样机和已有的平面激光化学微材料去除的科学技术知识的基础上，实现并表征一种紧凑的加工模块，该模块对外界干扰不敏感，可以与其他模块组合在一起，用于微细加工。

In the course of miniaturization, the importance of the industrial production of metallic microcomponents steadily increases. The size of the machines for the manufacture of such components stands in gross disproportion to the component size. The achievable accuracy is limited by inaccuracies of mechanical positioning elements and external disturbances such as vibration and thermal distortion. Laser chemical removal enables a contactless machining of metals using a comparatively low laser power density. Through the use of a micro-mirror array (DMD) for flexible beam shaping a 2-dimensional machining of the workpiece is possible. In laser material processing DMDs were due to their low damage threshold but not yet used. The laser chemical machining method used in this project should now allow for the first time to connect the DMD technology with laser-based micromachining. The aim of this project is to realized and characterise on the basis of the previously implemented laboratory prototype and the so won scientific and technical knowledge for the planar laser chemical micro material removal a compact processing module, which is desensitive to external disturbances and can be combined with other modules for a qualified use in microfabrication.