SIRG/Collaborative Research: Distributed Subwavelength Micro Photonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments
SIRG/Collaborative Research: Distributed Subwavelength Micro Photonic Sensors for In-situ Monitoring with High Spatial and Temporal Resolution in Manufacturing Environments
批准号:
0529444
负责人:
David Dornfeld
金额:
$26.96万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2005
资助国家:
美国
项目状态:
已结题
起止时间:
2005-10-01 至 2008-09-30
中文摘要
传感器和传感器网络(NSF 05-526),传感器跨学科研究小组(SIRG)项目的目标是通过研究新型亚波长微型光子传感器在空间和时间分辨率上的基本限制,开发创新的嵌入技术,并在实际制造过程中测试这些传感器,为实现这些传感器在制造环境中的应用进行基础研究。具体地说,研究小组将研究用于温度和应变测量的集成微型光子传感器的空间和时间分辨率的基本极限。微型光子传感器将嵌入金属中,以确保传感器在制造环境中的生存能力和可靠性。将开发一种创新的批量制造金属嵌入型亚波长微光子传感器。将研究和优化在制造环境中将金属嵌入的微型光子传感器转移到更大的金属结构中的技术。该研究小组还试图将这些传感器应用于实际制造试验台,并利用传感数据更好地从根本上理解半导体制造中的化学机械平坦化和钢铁生产中的连续铸造这两个重要过程。如果成功,这项研究将通过对亚波长光子传感器、嵌入金属的传感器以及实际制造过程中的传感进行跨学科研究,显著促进传感器技术的发展。新型亚波长微型光子传感器和创新的嵌入技术将产生高空间分辨率、高灵敏度和快速时间响应的测量结果。该项目的成功将极大地促进化学机械平坦化和钢铁工艺连铸的基础知识的发展。微光子传感器阵列的成功实施可以促进对许多其他制造工艺的基本了解,从而显著提高生产率并节省大量成本。除了计划中的出版物、面向行业的短期课程和专利外,工业试验台还将促进立即向行业转移技术。本科生和研究生将能够获得亚波长微光子技术的实践经验。将举办暑期工作坊,并将为K12学生和教师开发合适的科学模块。PIS还将吸引、留住和吸引来自代表性不足群体的学生。
英文摘要
The objective of this Sensors and Sensor Networks (NSF 05-526), Sensors Interdisciplinary Research Group (SIRG) project is to conduct fundamental investigations towards the implementation of novel subwavelength microphotonic sensors for applications in manufacturing environments by studying the fundamental limits in the spatial and temporal resolutions of these sensors, developing innovative embedding techniques, and testing sensors in real manufacturing processes. Specifically, the research group will study the fundamental limit in the spatial and temporal resolution of integrated microphotonic sensors for temperature and strain measurements. Microphotonic sensors will be embedded into metals to ensure sensor survivability and reliability in manufacturing environments. An innovative batch fabrication of metal embedded subwavelength microphotonic sensors will be developed. Techniques will be studied and optimized for transferring metal embedded microphotonic sensors into larger metallic structures in manufacturing environments. The research group also seeks to implement these sensors in real manufacturing testbeds and utilize sensing data to achieve a better fundamental understanding of two important processes, chemical mechanical planarization for semiconductor manufacturing and continuous casting for steel production.If successful, this research will significantly advance sensor technologies through an interdisciplinary study of subwavelength photonic sensors, sensor embedding into metals, and sensing in real manufacturing processes. Novel sub-wavelength microphotonic sensors along with innovative embedding techniques will yield measurements with high spatial resolution, high sensitivity, and fast temporal response. The success of this project can significantly advance fundamental knowledge for chemical mechanical planarization and continuous casting of steel processes. The successful implementation of microphotonic sensor arrays could advance the fundamental understanding of numerous other manufacturing processes, thus significantly improving productivity and generating significant cost savings. Industrial testbeds will facilitate immediate technology transfer to industry, in addition to planned publications, short courses to industry, and patents. Undergraduate and graduate students will be able to get hands-on experience in subwavelength microphotonic technology. Summer workshops will be held and suitable science modules will be developed for K12 students and teachers. The PIs will also attract, retain, and engage students from under-represented groups.
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Student Support: The 6th CIRP Conference on High Performance Cutting (HPC2014); University of California, Berkeley; June 23-25, 2014
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批准号:1411221
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项目类别:Standard Grant
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资助金额:$1.8万
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财政年份:2014
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负责人:David Dornfeld
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依托单位:
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批准号:1219532
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项目类别:Standard Grant
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资助金额:$1.95万
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财政年份:2012
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负责人:David Dornfeld
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依托单位:
Cleanability of Mechanical Components
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批准号:0621198
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项目类别:Standard Grant
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资助金额:$0.0万
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财政年份:2006
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负责人:David Dornfeld
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依托单位:
GOALI: Development of Comprehensive Drilling Simulation Tool
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批准号:0300549
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项目类别:Standard Grant
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资助金额:$40.0万
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财政年份:2003
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负责人:David Dornfeld
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依托单位:
GOALI - Green CMP: Chemical Mechanical Planarization Process Modeling for Minimizing Environmental Impact
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批准号:0200204
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项目类别:Continuing Grant
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资助金额:$32.5万
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财政年份:2002
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负责人:David Dornfeld
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依托单位:
GOALI: Process Monitoring and Development for Chemical Mechanical Polishing (CMP)
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批准号:9813039
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项目类别:Standard Grant
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资助金额:$30.5万
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财政年份:1998
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负责人:David Dornfeld
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依托单位:
SGER: Intelligent Manufacturing Systems - Holonic Control Systems
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批准号:9319102
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项目类别:Standard Grant
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资助金额:$1.0万
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财政年份:1993
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负责人:David Dornfeld
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依托单位:
Workshop on Chinese Design and Production Engineering Research; Tempe, AZ; January 8-12, 1990
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批准号:9001495
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项目类别:Standard Grant
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资助金额:$13.47万
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财政年份:1989
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负责人:David Dornfeld
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依托单位:
Expedited Award for Novel Research: Precision Machine Tools Using Rotary Tools
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批准号:8915632
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项目类别:Standard Grant
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资助金额:$3.8万
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财政年份:1989
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负责人:David Dornfeld
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依托单位:
1989 Manufacturing Systems Research Conference: Fifteenth NSF Grantees Conference on Production Systems and Technol- ogy; Berkeley, California; January 9-13, 1989
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批准号:8901760
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项目类别:Standard Grant
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资助金额:$3.98万
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财政年份:1988
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负责人:David Dornfeld
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依托单位:
Sensing for Manufacturing Process Automation-Welding
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批准号:8508412
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项目类别:Continuing Grant
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资助金额:$39.46万
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财政年份:1986
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负责人:David Dornfeld
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依托单位:
Review of Modern Control and Signal Processing in Flexible Automation and Manufacturing in Japan
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批准号:8501442
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项目类别:Standard Grant
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资助金额:$1.0万
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财政年份:1986
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负责人:David Dornfeld
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依托单位:
Development of a Comprehensive Control Strategy For Gas Metal Arc Welding
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批准号:8102889
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项目类别:Continuing Grant
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资助金额:$10.5万
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财政年份:1981
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负责人:David Dornfeld
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依托单位:
Investigation of Metal Cutting and Forming Process Fundamentals and Control Using Acoustic Emission
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批准号:8112843
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项目类别:Continuing Grant
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资助金额:$55.56万
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财政年份:1981
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负责人:David Dornfeld
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依托单位:
Tool Wear Sensing Via Acoustic Emission Analysis
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批准号:7917326
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项目类别:Standard Grant
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资助金额:$9.95万
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财政年份:1979
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负责人:David Dornfeld
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依托单位:
海外基金