课题基金 / 基金详情

GOALI - Green CMP: Chemical Mechanical Planarization Process Modeling for Minimizing Environmental Impact

GOALI - Green CMP: Chemical Mechanical Planarization Process Modeling for Minimizing Environmental Impact
GOALI - 绿色 CMP:化学机械平坦化工艺建模,最大限度地减少环境影响
批准号:
0200204
负责人:
David Dornfeld
金额:
$32.5万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2002
资助国家:
美国
项目状态:
已结题
起止时间:
2002-07-01 至 2005-06-30

项目摘要

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中文摘要
翻译
化学机械平坦化是多层硅微电子器件生产中最关键的工序之一。该研究项目的目标是开发一个环境建模框架,该框架结合了化学机械抛光工具部件的机械力-化学模拟、环境影响因素和拥有成本(COO),该框架基于合格的化学机械抛光材料去除可变敏感过程模型。这项工作将把早期的工作扩展到综合过程评估框架内更详细的过程能力模型。在这里,我们将重点放在机械相互作用模型的继续发展以及化学效应和对过程的影响的模型上。我们希望确定材料去除(在特定点和晶片表面上)对工艺变量的依赖性,如浆料、图案密度、晶片材料等。该模型将能够提供有关设计新的或新颖的焊盘几何形状的信息,以促进“环境高效的化学机械抛光”。加州大学圣地亚哥分校关于化学去除机制的工作是伯克利之前工作的补充。由此产生的软件将把工艺模型与更高级别的工具联系起来,用于评估工艺的环境影响以及上下游的能源、消耗品和废物要求。这种基于模型的“环境分析工具”将为工艺工程师、产品和工具设计人员提供量化建议,使他们能够确保在保持工艺能力和高标准产品的同时,将能源、浪费和消耗品的使用降至最低--即环保制造。
英文摘要
Chemical-mechanical planarization (CMP) is one of the most critical steps in the production of multilayer silicon microelectronic devices. The goal of the research project is to develop a framework for environmental modeling which combines mechanical-chemical modeling of CMP tool components, environmental impact factors and cost of ownership (CoO) based upon competent variable sensitive process models of material removal in CMP. This work will extend earlier work to more detailed process capable models within an integrated process assessment framework. We focus here on the continued development of models for the mechanical interactions as well as models of the chemical effects and influence on the process. We expect to determine the dependency of material removal (both at a specific point and over the wafer surface) on process variables such as slurry, pattern density, wafer material, etc. The model will be able to offer information on designing new or novel pad geometries to facilitate "environmentally efficient CMP." The work at UC, San Diego, on chemical removal mechanisms, is added to prior work at Berkeley. The resulting software will link process models to higher-level tools for assessing the environmental impact of the process and the upstream and downstream energy, consumable and waste requirements. A result of this model-based "environmental analysis tool" will be quantitative suggestions to process engineers and product and tool designers to enable them to insure that energy, waste and consumable use is minimized while maintaining the capability of the process and high product standards - that is - Environmentally Benign Manufacturing.
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Student Support: The 6th CIRP Conference on High Performance Cutting (HPC2014); University of California, Berkeley; June 23-25, 2014
  • 批准号:
    1411221
  • 项目类别:
    Standard Grant
  • 资助金额:
    $1.8万
  • 财政年份:
    2014
  • 负责人:
    David Dornfeld
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Support for Student and Postdoc Participation in the 19th CIRP Conference on Life Cycle Engineering (LCE 2012); Berkeley, California; 23-25 May 2012
  • 批准号:
    1219532
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    $1.95万
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    2012
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  • 依托单位:
Cleanability of Mechanical Components
  • 批准号:
    0621198
  • 项目类别:
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  • 负责人:
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  • 批准号:
    0529444
  • 项目类别:
    Standard Grant
  • 资助金额:
    $26.96万
  • 财政年份:
    2005
  • 负责人:
    David Dornfeld
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