GOALI - Green CMP: Chemical Mechanical Planarization Process Modeling for Minimizing Environmental Impact

GOALI - 绿色 CMP：化学机械平坦化工艺建模，最大限度地减少环境影响

• 批准号: 0200204
• 负责人: David Dornfeld
• 金额: $ 32.5万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2002
• 资助国家: 美国
• 起止时间: 2002-07-01 至 2005-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0200204&HistoricalAwards=false
• 关键词: GOALI; Green; CMP; Chemical; Mechanical

Chemical-mechanical planarization (CMP) is one of the most critical steps in the production of multilayer silicon microelectronic devices. The goal of the research project is to develop a framework for environmental modeling which combines mechanical-chemical modeling of CMP tool components, environmental impact factors and cost of ownership (CoO) based upon competent variable sensitive process models of material removal in CMP. This work will extend earlier work to more detailed process capable models within an integrated process assessment framework. We focus here on the continued development of models for the mechanical interactions as well as models of the chemical effects and influence on the process. We expect to determine the dependency of material removal (both at a specific point and over the wafer surface) on process variables such as slurry, pattern density, wafer material, etc. The model will be able to offer information on designing new or novel pad geometries to facilitate "environmentally efficient CMP." The work at UC, San Diego, on chemical removal mechanisms, is added to prior work at Berkeley. The resulting software will link process models to higher-level tools for assessing the environmental impact of the process and the upstream and downstream energy, consumable and waste requirements. A result of this model-based "environmental analysis tool" will be quantitative suggestions to process engineers and product and tool designers to enable them to insure that energy, waste and consumable use is minimized while maintaining the capability of the process and high product standards - that is - Environmentally Benign Manufacturing.

化学机械平面化（CMP）是生产多层硅微电子器件的关键步骤之一。该研究项目的目标是开发一个环境建模框架，该框架结合了CMP工具组件的机械化学建模，环境影响因素和拥有成本（CoO），基于CMP中材料去除的称职变量敏感过程模型。这项工作将把早期的工作扩展到集成过程评估框架内更详细的过程能力模型。我们在此着重于力学相互作用模型的持续发展，以及化学作用和对过程影响的模型。我们期望确定材料去除（在特定点和晶圆表面）对工艺变量的依赖关系，如浆液、图案密度、晶圆材料等。该模型将能够提供设计新的或新颖的垫几何形状的信息，以促进“环境高效的CMP”。加州大学圣地亚哥分校对化学去除机制的研究是在伯克利分校之前工作的基础上进行的。由此产生的软件将把过程模型与更高层次的工具联系起来，以评估过程对环境的影响以及上游和下游的能源、消耗品和废物需求。这种基于模型的“环境分析工具”的结果将是向工艺工程师、产品和工具设计师提供定量建议，使他们能够确保在保持工艺能力和高产品标准的同时，最大限度地减少能源、浪费和消耗品的使用，即环保制造。