GOALI - Green CMP: Chemical Mechanical Planarization Process Modeling for Minimizing Environmental Impact

化学机械平坦化（CMP）是制造多层硅微电子器件的关键步骤之一。该研究项目的目标是开发一个环境建模的框架，它结合了CMP工具组件，环境影响因素和拥有成本（CoO）的基础上主管可变敏感的CMP材料去除工艺模型的机械化学建模。这项工作将扩展早期的工作，更详细的过程中能够在一个综合的过程评估框架模型。在这里，我们专注于机械相互作用模型的持续发展，以及化学效应和对过程的影响的模型。我们期望确定材料去除（在特定点和晶片表面）对工艺变量（如浆料、图案密度、晶片材料等）的依赖性。该模型将能够提供设计新的或新颖的抛光垫几何形状的信息，以促进“环保高效的CMP”。“在加州大学圣地亚哥分校的工作，化学去除机制，是增加到以前的工作在伯克利分校。由此产生的软件将把工艺模型与更高层次的工具联系起来，以评估工艺对环境的影响以及上游和下游的能源、消耗品和废物要求。这种基于模型的“环境分析工具”的结果将是对工艺工程师和产品及工具设计者的定量建议，使他们能够确保在保持工艺能力和高产品标准的同时，最大限度地减少能源、废物和消耗品的使用-即环境友好型制造。

Chemical-mechanical planarization (CMP) is one of the most critical steps in the production of multilayer silicon microelectronic devices. The goal of the research project is to develop a framework for environmental modeling which combines mechanical-chemical modeling of CMP tool components, environmental impact factors and cost of ownership (CoO) based upon competent variable sensitive process models of material removal in CMP. This work will extend earlier work to more detailed process capable models within an integrated process assessment framework. We focus here on the continued development of models for the mechanical interactions as well as models of the chemical effects and influence on the process. We expect to determine the dependency of material removal (both at a specific point and over the wafer surface) on process variables such as slurry, pattern density, wafer material, etc. The model will be able to offer information on designing new or novel pad geometries to facilitate "environmentally efficient CMP." The work at UC, San Diego, on chemical removal mechanisms, is added to prior work at Berkeley. The resulting software will link process models to higher-level tools for assessing the environmental impact of the process and the upstream and downstream energy, consumable and waste requirements. A result of this model-based "environmental analysis tool" will be quantitative suggestions to process engineers and product and tool designers to enable them to insure that energy, waste and consumable use is minimized while maintaining the capability of the process and high product standards - that is - Environmentally Benign Manufacturing.