GOALI/Collaborative Research: Integrated Sensing System for Stamping Monitoring and Control

该研究项目的目标是发明一种与冲压机集成的新型传感系统，以显着提高冲压过程的可观察性和可控性。该目标将通过调查的几何可扩展性的拉入传感器，是基于互感的原则，和无线压力传感器，通过声波与远程超声接收器进行通信。新的传感器将嵌入冲压模具中，而不会干扰高速操作，从而提供一种在美国国内外最先进的冲压行业中尚不存在的支持工具。 该项目的智力贡献将是扩展电磁耦合和声学遥测的基本物理定律，以指导设想的传感器的功能和参数设计，使它们能够准确可靠地测量所需的过程参数，考虑到通常与冲压操作相关的重大冲击力和干扰，这项研究的更广泛的影响包括通过工具嵌入式传感器创建物理测量和数值模拟之间的直接比较方法，从而将过程的监测和控制与并因此利用数字工具的进步。 研究成果将通过开放式演示和短期课程与学术界和工业界分享。还计划举办联合研讨会系列和学生交流活动。

The objective of this Grant Opportunity for Academic Liaison with Industry (GOALI) Collaborative Research project is to invent a new sensing system integrated with stamping press to significantly improve the observability and controllability of the stamping process. The objective will be achieved by investigating the geometrical scalability of draw-in sensors that are based on the principal of mutual electrical inductance, and wireless pressure sensors that communicate with remote ultrasound receivers through acoustic waves. The new sensors will be embedded within the stamping tooling without interfering with high-rate operations, thus providing an enabling tool that is not yet existent in the state-of-the-art stamping industry within or outside of the US. The intellectual contribution of this project will be extending fundamental laws of physics on electromagnetic coupling and acoustic telemetry to guide the functional and parametric design of the envisioned sensors such that they can accurately and reliably measure the required process parameters, given the significant impact forces and interferences typically associated with the stamping operation, thus advancing the science base for stamping process monitoring.The broader impact of this research includes creating means for direct comparison between physical measurements and numerical simulations through tooling-embedded sensors, such that monitoring and control of the process are integrated with, and therefore, taking advantage of, the advancement in numerical tools. Research results will be shared with both the academic and industrial communities through open-house demos and a short course. Joint seminar series and student exchange are also planned.