Next generation die attach technologies using nanoengineered materials

这项研究的目标是为未来的半导体封装应用开发一种新的焊接技术。该方法涉及发展熔融金属纳米颗粒技术作为“焊料”材料。通过利用金属纳米颗粒的低熔点，这项技术将在电气性能、可靠性和环境兼容性方面比传统焊料实现显著改善。这反过来又应该允许微电子技术的继续扩大和发展。传统的焊接技术面临着极大的挑战。环境法规导致了对铅基焊料的抛弃。还出现了向基于聚合物的封装的转变，对最高加工温度施加了限制。芯片密度的增加也导致了对前所未有的I/O引脚密度的需求。这项建议中所追求的新型焊料技术通过纳米颗粒合成、可打印纳米颗粒油墨的开发用作焊料、以及纳米颗粒焊点的电学特性和可靠性的表征来专门满足这些需求。这项建议具有重要的技术意义，因为它将有助于为未来几代半导体封装技术开发可行的焊接技术。随着低成本、便携式、系统级封装消费类电器的持续部署，对包装技术的巨大改进的需求是巨大的。这项提案的更广泛影响包括指导本科生进行研究，向高中生提供帮助，以帮助他们留住科学和工程专业，并通过在黑人历史悠久的学院和大学开展招生活动，向代表不足的少数群体提供帮助，目的是吸引少数族裔学生投身工程研究。

The objective of this research is the development of a novel solder technology for future semiconductor packaging applications. The approach involves the development of fused metallic nanoparticle technology as a "solder" material. This technology will achieve dramatic improvements in electrical performance, reliability, and environmental compatibility over conventional solders by exploiting the low melting temperature of metallic nanoparticles. This in turn should allow the continued scaling and evolution of microelectronics technology. Challenges for conventional solder technology are extreme. Environmental regulations have resulted in a move away from lead-based solders. There has also been a move towards polymer-based packages, placing constraints on peak processing temperatures. Increased chip densities have also resulted in the need for unprecedented I/O pin densities. The novel solder technology pursued in this proposal specifically addresses these needs through efforts in nanoparticle synthesis, development of printable nanoparticle inks for use as solders, and characterization of electrical properties and reliability of nanoparticle solder joins.This proposal is technically important since it will contribute to the development of a viable solder technology for future generations of semiconductor packaging technology. With the continued deployment of low-cost, portable, system-in-package consumer appliances, the need for dramatic improvements in packaging technology are tremendous. Broader impacts of this proposal include mentorship of undergraduates in research, outreach to high-school students to facilitate their retention in science and engineering, and outreach to underrepresented minority groups through recruiting activities at historically black colleges and universities, with the goal of attracting underrepresented minority students into engineering research.