SBIR Phase I: Resonance Ultrasonic Vibrations for Defect Characterization in Solar Silicon Wafers

这个小型企业创新研究（SBIR）第一阶段研究项目解决了快速准确评估太阳级全尺寸（高达210毫米）硅（Si）晶圆机械缺陷的创新实验方法的基础。目的是验证共振超声振动（RUV）系统的商业原型，该系统最终将用作实时在线过程控制工具，用于识别和排除太阳能电池生产线上机械不稳定的晶圆，即由于外围裂纹和高残余应力而导致的易碎晶圆。该计划的更广泛影响将是RUV系统的商业化，以解决光伏（PV）行业的关键需求。近年来，全球光伏市场以每年高达40%的速度稳定增长。这种方法也有应用于其他技术的潜力，例如高速电子器件中的硅隔离片和SiGe外延层的应力监测，以及平板显示器玻璃上的多晶硅薄膜的粘附质量评估。

This Small Business Innovative Research (SBIR) Phase I research project addresses fundamentals of the innovative experimental methodology for quick and accurate assessment of mechanical defects in solar-grade full-size (up to 210 mm) silicon (Si) wafers. The objective is to justify a commercial prototype of the Resonance Ultrasonic Vibrations (RUV) system which ultimately will be used as a real-time in-line process control tool for identification and rejection from a solar cell production line of mechanically unstable, i.e. fragile wafers due to periphery cracks and high level of residual stress. The broader impact of the program will be in the commercialization of the RUV system to address critical needs of the photovoltaic (PV) industry. The world-wide PV market exhibits a steady yearly up to 40% growth rate in recent years. There is potential for applying this approach to other technologies, such as stress monitoring in Silicon-on isolator wafers and SiGe epitaxial layers in high-speed electronics and adhesion quality assessment in thin polycrystalline Si films on glass for flat panel displays.