STTR Phase II: Improved Boron Nitride Materials for Enhanced Thermal Management

这个小型企业技术转移（STTR）第二阶段项目建立在第一阶段成功的成果基础上，开发用于电子热管理应用的表面改性氮化硼（BN）填充材料。新型原子层沉积（ALD）纳米涂层用于选择性地功能化边缘或边缘/基面，以改善树脂包封剂对BN片的润湿。改进的润湿性允许在加工过程中降低BN/树脂混合物的粘度，从而可以实现BN填料颗粒负载的增加，从而提高电子封装的导热性。这些改进最好是通过超薄（nm厚）、保形、无针孔、化学键合的二氧化硅纳米膜选择性地放置在初级BN片的边缘来实现。涂层血小板边缘只提供低成本影响，因为被纳米涂层的边缘只占血小板可用表面积的不到10%。在填充复合材料中更高的BN负载允许改善电子封装材料的散热，特别是在球形顶部涂层和灌封化合物的情况下。拟议的第二阶段研发重点是与潜在客户合作，为其特定的成型复合系统开发颗粒ALD表面改性BN填料的应用。薄膜化学和厚度将为其特定应用而发展。在商业上，与传统的CVD、PVD、PE-CVD或湿化学溶液处理相比，ALD纳米涂层可以控制单个超细颗粒的表面化学性质，这是一项无与伦比的技术。该工艺允许单个超细颗粒被纳米涂层，而不是涂层超细颗粒的聚集体。它与视线无关，并提供了化学结合膜到基片颗粒表面。它很容易扩展。这是一种宽容的工艺，纳米涂层的厚度是由自限制的表面反应控制的（而不是通量、温度或处理时间，如CVD等）。ALD薄膜无针孔且适形。成功的大规模加工的潜在影响远远超出了这个提议的微电子封装应用。现在有可能生产出具有设计好的电学、磁学、光学、机械、流变学或其他特性的超细颗粒。这种功能化超细粉末的市场包括微电子、国防、硬质合金、化妆品、药物输送、高能材料和聚合物/陶瓷纳米复合材料等。

This Small Business Technology Transfer (STTR) Phase II project builds upon the successful Phase I results to develop surface modified boron nitride (BN) filler materials for electronic thermal management applications. Novel Atomic Layer Deposition (ALD) nanocoating is used to selectively functionalize edges only or edges/basal planes to improve wetting of BN platelets with resin encapsulants. The improved wetting allows for reduced viscosity of BN/resin mixtures during processing so that increased BN filler particle loadings can be achieved, resulting in higher thermal conductivity electronic packages. These improvements are best realized using an ultra-thin (nm thick), conformal, pin-hole free, chemically bonded silica nanofilm selectively placed on the edges of primary BN platelets. Coating the edges of platelets only provides for a low cost impact since edges being nanocoated represent less than 10% of the available platelet surface area. Higher BN loadings in filled composites allow for improved heat dissipation in electronic packaging materials, particularly in the case of glob top coatings and potting compounds. Proposed Phase II R&D is focused on working with potential customers to develop applications of particle ALD surface modified BN fillers for their specific moulding compound systems. Film chemistry and thickness will be developed for their specific applications.Commercially, the ALD nanocoating of individual ultrafine particles to control their surfacechemistry is enabling technology that is unparalleled compared to more conventional CVD,PVD, PE-CVD, or wet chemistry solution processing. The process allows for individualultra-fine particles to be nanocoated, rather than coating aggregates of ultra-fine particles. Itis independent of line of sight and provides for chemically bonded films to the substrateparticle surface. It is easily scalable. It is a forgiving process where the nanocoatingthickness is controlled by self-limiting surface reactions (not flux, temperature, or time ofprocessing like CVD, etc.). ALD films are pin-hole free and conformal. The potentialimpact of successful large scale processing extends far beyond this proposedmicroelectronics packaging application. It is now possible to produceultrafine particles with designed electrical, magnetic, optical, mechanical, rheological, orother properties. Markets for such functionalized ultra-fine powders includemicroelectronics, defense, hardmetals, cosmetics, drug delivery, energetic materials, andpolymer/ceramic nanocomposites, among others.