STTR Phase I: Thermally-Assisted Electro-Etching of Electronics Packages

这个小型企业技术转让(STTR)第一阶段项目致力于印刷电路板和电子封装制造的使能技术。为了提高集成电路密度、性能和可靠性，同时减小电子模块的尺寸、重量和成本，要求互连和封装采用宽度小于75微米的线路和空间。互连的穿透掩膜化学蚀刻以各向同性的方式侵蚀掩膜下的铜，将特征尺寸限制在75微米以上。拟议的创新，热辅助电蚀刻，结合了法拉第电化学蚀刻，以产生通过掩模的各向异性电流分布，以及脉冲热源，通过选择性加热暴露的铜来增强各向异性蚀刻。与化学蚀刻不同，这项技术将允许通过掩模蚀刻宽度为25-30微米的特征。第一阶段项目将通过设计和建造一种设备来展示这项技术，该设备可以促进受控腐蚀、电解液选择、电化学和热工艺参数的优化，以及对该技术的经济评估。预期的结果是一种坚固、各向异性、成本效益高的穿透掩模蚀刻工艺，用于75微米以下的电子封装特征。由Faraday、哥伦比亚大学和洛克希德-马丁公司组成的项目团队将为技术验证和商业化奠定基础。如果研究项目成功，将导致更高密度、更低成本的互连应用。拟议的技术创新是良性的，不会对环境和工人安全造成不利影响。哥伦比亚大学本科生和研究生的劳动力发展是意料之中的，法拉第经常分别与NSF的REU和RET项目一起为当地本科生和高中教师提供机会。

This Small Business Technology Transfer (STTR) Phase I project addresses an enabling technology for fabrication of printed circuit boards and electronic packages. The demand for increased integrated circuit density, performance and reliability while reducing size, weight and cost of electronic modules requires interconnects and packaging to employ lines and spaces that are less than 75 micron in width. Through-mask chemical etching of interconnects isotropically attacks copper under the mask, limiting feature sizes to larger than 75 micron. The proposed innovation, Thermally-Assisted Electro-Etching, combines Faradayic electrochemical etching to generate an anisotropic current distribution through the mask, with a pulsed thermal source to enhance anisotropic etching by selective heating of the exposed copper. Unlike chemical etching, this technology will enable through-mask etching of features 25 - 30 micron in width. The Phase I project will demonstrate this technology through design and build of an apparatus that promotes controlled etching, electrolyte selection, optimization of electrochemical and thermal process parameters, and an economic evaluation of the technology. The anticipated result is a robust, anisotropic, cost-effective through-mask etching process for electronic packaging features below 75 micron. The project team, Faraday, Columbia University and Lockheed-Martin, will set the stage for technology validation and commercialization.The research project, if successful, will result in higher density, lower cost interconnect applications. The proposed technological innovation is benign and will not adversely impact the environment nor worker safety. Workforce development with Columbia undergraduate and graduate students is anticipated and Faraday routinely provides opportunities for local undergraduate students and high school teachers in conjunction with NSF's REU and RET programs, respectively.