GOALI: Dynamic Adhesive Failure of Patterned Thin Films

该合作项目旨在解决一个长期存在的问题，在多层薄膜器件粘合剂失效和随之而来的分层。该研究将为研究对微电子封装至关重要的多层薄膜器件的粘接失效提供新的实验和计算工具。具体来说，将研究表面特性、工艺诱导的残余应力和加载速率之间的复杂关系，以对界面破坏有更基本的了解。实验工作的重点是创建一个协议，以产生控制界面分层利用惯性效应与激光产生的应力波。这种优雅的非接触式加载技术为表征界面失效提供了一种可靠的方法。在实验的基础上，开发了一种结合谱/有限元的方案来提取界面断裂能，并评估界面牵引力的演化和流入裂纹尖端的能量分量。根据该GOALI计划制定的测试和分析协议将过渡到微电子行业使用。该项目将支持伊利诺伊大学研究生和本科生的教育和培训。这些学生将成为贝克曼高级科学技术研究所跨学科研究小组的一员，该小组将通过小组会议、研讨会和设在同一地点的实验室设施，促进与其他学生和教师的重要互动。

This collaborative project seeks to address a longstanding problem in multilayer thin film devices adhesive failure and attendant delamination. The research will lead to the development of new experimental and computational tools for studying the adhesive failure in multilayer thin film devices critical to microelectronic packaging. Specifically, the complex relationships between surface properties, process-induced residual stress, and loading rate will be investigated to achieve a more fundamental understanding of interfacial failure. Experimental efforts focus on creating a protocol to generate controlled interfacial delamination using the inertial effects associated with laser generated stress waves. This elegant, non-contacting loading technique provides a robust method for characterizing interfacial failure. The experiments are supported by the development of a combined spectral/finite element scheme to extract the interfacial fracture energy and evaluate the evolution of interface tractions and the components of energy flowing into the crack-tip. The testing and analysis protocols developed under this GOALI program will be transitioned for use by the microelectronics industry. The project will support the education and training of graduate and undergraduate students at the University of Illinois. These students will be part of an interdisciplinary research group at the Beckman Institute for Advanced Science and Technology that will foster critical interactions with other students and faculty through group meetings, seminars and co-located lab facilities.