Additive Patterning of Integrated Functional Materials on a Chip
芯片上集成功能材料的增材图案化
基本信息
- 批准号:0088206
- 负责人:
- 金额:$ 45万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2000
- 资助国家:美国
- 起止时间:2000-09-15 至 2004-02-29
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Nancy R. Sottos and David A. Payne, University of Illinois at Urbana-ChampaignProposal Number #0088206Additive Patterning of Integrated Functional Materials on a Chip A critical issue for the future engineering of microsystems on a chip is the ability to rapidly pattern dissimilar materials in complex integrated systems. A novel, additive method of patterning is proposed that will enable integration of functional materials (e.g., electrical, mechanical, optical, etc.) on a chip, rather than as a discrete component added into the circuit and system. Specifically, an interdisciplinary investigation is planned to examine additive patterning of integrated electroceramic thin film devices and to develop a better understanding of the complex residual stress development in the films during this process. Integration of electroceramic thin films is a key technology for the realization of future micro electromechanical (MEM) device applications such as miniaturized sensors and actuators, ultrasonic motors and optical elements as well as nonvolatile memory elements and switching capacitors for integrated circuitry. In order to advance this technology for the next generation of electromechanical devices, it is essential to develop a fundamental understanding of the residual stresses generated in the films during patterning, the effects of these stresses on film properties and how to tailor these stresses for optimal device performance. Specific goals of this interdisciplinary investigation include: (i) development of new protocols to pattern thicker electroceramic films and multilayer devices where residual stresses are most critical, (ii) in-situ measurement of residual stress development during patterning, (iii) development of analytical models to understand the role of the substrate, film adhesion, and processing conditions on residual stress, (iv) characterization of the electromechanical properties of patterned films and assess the effects of residual stress on performance, and (v) development of a strategy for tailoring the residual stress state for optimal performance and reliability of the device.
南希河Sottos和大卫A. Payne,University of Illinois at Urbana-ChampaignProposal Number #0088206Additive Patterning of Integrated Functional Materials on a Chip未来芯片上微系统工程的一个关键问题是在复杂集成系统中快速图案化不同材料的能力。 提出了一种新颖的、附加的图案化方法,该方法将使得能够集成功能材料(例如,电气、机械、光学等)在芯片上,而不是作为添加到电路和系统中的分立元件。 具体而言,计划进行跨学科的调查,以检查添加剂图案化的集成电瓷薄膜器件,并制定一个更好的理解在这个过程中的膜中的复杂的残余应力的发展。 电子陶瓷薄膜的集成是实现未来微机电(MEM)器件应用的关键技术,例如微型传感器和致动器、超声马达和光学元件以及用于集成电路的非易失性存储器元件和开关电容器。 为了推进这一技术的下一代机电设备,它是必不可少的发展过程中产生的残余应力的膜图案,这些应力对膜性能的影响,以及如何定制这些应力的最佳设备性能的基本理解。 这一跨学科研究的具体目标包括:(i)开发新的方案以图案化较厚的电陶瓷膜和多层器件,其中残余应力是最关键的,(ii)在图案化期间残余应力发展的原位测量,(iii)开发分析模型以理解衬底、膜粘附和处理条件对残余应力的作用,(iv)表征图案化膜的机电性质并评估残余应力对性能的影响,以及(v)开发用于定制残余应力状态以获得器件的最佳性能和可靠性的策略。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Nancy Sottos其他文献
Nancy Sottos的其他文献
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{{ truncateString('Nancy Sottos', 18)}}的其他基金
GOALI: Manufacturing USA: Energy Efficient Processing of Thermosetting Polymers and Composites
目标:美国制造:热固性聚合物和复合材料的节能加工
- 批准号:
1933932 - 财政年份:2019
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
LEAP HI: Manufacturing USA: Energy Efficient Processing of Thermoset Polymers and Composites
LEAP HI:美国制造:热固性聚合物和复合材料的节能加工
- 批准号:
1830635 - 财政年份:2018
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
CAREER: Spatiotemporal Avalanche Kinetics in Size-Dependent Crystal Plasticity
职业:尺寸依赖性晶体可塑性的时空雪崩动力学
- 批准号:
1654065 - 财政年份:2017
- 资助金额:
$ 45万 - 项目类别:
Continuing Grant
Gordon Research Conference on Multifunctional Materials and Structures: Bridging the Gap between Biological and Synthetic Systems; Ventura, California; 14-19 January 2018
戈登多功能材料和结构研究会议:弥合生物和合成系统之间的差距;
- 批准号:
1745439 - 财政年份:2017
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
SusChem/FRG/GOALI: Mechanochemically Based Sustainable Polymers
SusChem/FRG/GOALI:基于机械化学的可持续聚合物
- 批准号:
1307354 - 财政年份:2013
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
Molecular Tailoring of Interfacial Fracture
界面断裂的分子剪裁
- 批准号:
1161517 - 财政年份:2012
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
GOALI: Dynamic Adhesive Failure of Patterned Thin Films
目标:图案化薄膜的动态粘合失效
- 批准号:
0726742 - 财政年份:2007
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
Thin Film Fracture and Decohesion in Micro- and Nano-Patterned Devices
微米和纳米图案器件中的薄膜断裂和剥离
- 批准号:
0408487 - 财政年份:2004
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
GOALI: Self-healing Polymers for Improved Fatigue Performance
GOALI:自修复聚合物可提高疲劳性能
- 批准号:
0218863 - 财政年份:2002
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
Determination of Thin Film Interfacial Properties by Laser Generated Stress Waves
通过激光产生的应力波测定薄膜界面特性
- 批准号:
9988127 - 财政年份:2000
- 资助金额:
$ 45万 - 项目类别:
Standard Grant
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