SBIR Phase I: Multi-Dimensional Standing Wave Sensors for Measurement Across Dimensional Scales

这个SBIR第一阶段的研究计划解决了一个具有内在能力的颠覆性工具，可以在多个维度尺度上测量、操纵和修改三个维度。基本前提是集中在一个能量源能够提供，创建和维持一个多维虚拟尖端高纵横比探头。该技术和方法使尖端能够被编程成各种几何形状，同时还提供了检测3D空间中表面相互作用的能力。在纳米和微测量中，当装备在测量机上时，虚拟尖端提供了通过连续扫描进行高速测量的能力，很容易扩展到纳米级特征，并且可以深入到深腔和孔中进行3D测量。当前驻波一维传感器的科学遗产将被扩展到研究这种创新的多维传感器，用于高纵横比微尺度特征测量。研究领域包括探索具有多维能力的线性驱动模式，建立多谐驻波模式的非线性动力学建模，以及研究亚微米特征测量的标度问题。最近的各种报告都指出，微尺度和纳米尺度的计量工具是跨多维尺度创新的瓶颈。技术壁垒继续出现在三个广泛的领域——测量、修改和操作。现在有许多制造微尺度特征的行业无法提供质量检测工具。在这些规模上运行的仪器工具市场将具有颠覆性，从而使新兴市场的科学洞察力、预测过程能力、增强的功能和跨规模的连接成为可能。该技术平台可用于从半导体到MEMS的一系列应用。

This SBIR Phase I research proposal addresses a disruptive tool with the inherent ability to measure, manipulate, and modify in three dimensions across multiple dimensional scales. The basic premise is focused upon an energy source capable of delivering, creating, and sustaining a multidimensional virtual tip high aspect ratio probe. The technology and approach enable the tip to be programmed into various geometric shapes while also providing the capability to detect surface interactions in a 3D space. In nano and micro-measurement this virtual tip when equipped on a measuring machine, provides the ability to perform high speed measuring through continuous scanning, is readily scaleable to nanoscale features, and enables reach into deep cavities and holesfor 3D measurement. The current scientific heritage in standing wave 1D sensors will be extended to investigate this innovative multi-dimensional sensor for high aspect ratio microscale feature measurements. Research areas include exploring linear driven mode with multi-dimensional capability, nonlinear dynamic modeling for setting up multi-harmonic standing wave modes, and investigating scaling issues for sub-micrometer feature measurements.Various recent reports have both identified microscale and nanoscale metrology tools as a bottleneck to innovation across multi-dimensional scales. Technology barriers continue to arise in three broad areas - measurement, modification, and manipulation. There are many industries now fabricating microscale features with inability to offer quality inspection tools. The market for instrumented tools operating at these scales is, and will be, disruptive thereby enabling scientific insight for emerging markets, predictive process capabilities, enhanced functionality, and connectivity across scales. This technology platform springboards into an array of applications ranging from semiconductor to MEMS.