TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware

虽然用于计算和数据存储的硬件资源现在很丰富，但经济因素阻碍了专门的硬件安全机制被集成到商品部件中。系统所有者既需要开发廉价、快速的商用微处理器，又需要确保关键的安全属性保持不变。这项研究将探索一种新的方法来增强制造后的商用硬件，以提高安全运行。基本的方法是在现有的集成电路上增加一个单独的硅层，容纳精选的安全功能。这种3-D集成将安全策略实施的功能和经济性与底层计算硬件分离。因此，安全增强是仅适用于需要它们的系统的制造选项，这解决了经济困境。我们计划确定通过这种方法实现的最小和可实现的电路级安全功能集，这些功能可以由软件层明智地控制。这将大大有助于降低通常与安全机制相关的软件复杂性和系统漏洞。这项研究介绍了一种将安全机制整合到硬件中的全新方法，并有可能显著改变可信系统的经济性。通过合作和教育活动将产生更广泛的影响。研究生和本科生研究助理将向未来的教师、研究人员和信息保障专业人员传授知识；项目出版物将向嵌入式系统和硬件设计社区提供直接的技术传授。

While hardware resources for computation and data storage are now abundant, economic factors prevent specialized hardware security mechanisms from being integrated into commodity parts. System owners are caught between the need to exploit cheap, fast, commodity microprocessors and the need to ensure that critical security properties hold. This research will explore a novel way to augment commodity hardware after fabrication to enhance secure operation. The basic approach is to add a separate silicon layer, housing select security features, onto an existing integrated circuit. This 3-D Integration decouples the function and economics of security policy enforcement from the underlying computing hardware. As a result, security enhancements are manufacturing options applicable only to those systems that require them, which resolves the economic quandary. We plan to identify a minimal and realizable set of circuit-level security capabilities enabled by this approach, which can be judiciously controlled by the software layers. This will significantly assist in reducing both the software complexity often associated with security mechanisms and system vulnerabilities. This research introduces a fundamentally new method to incorporate security mechanisms into hardware and has the potential to significantly shift the economics of trustworthy systems. A broader impact will result through collaborative and educational activities. Graduate and undergraduate student research associates will transfer knowledge to future teachers, researchers and Information Assurance professionals; and project publications will provide direct technical transfer to the embedded-systems and hardware-design communities.