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MRI-R2: Acquisition of High Performance Deep Reactive Ion Etching System for Multidisciplinary Engineering Applications

MRI-R2: Acquisition of High Performance Deep Reactive Ion Etching System for Multidisciplinary Engineering Applications
MRI-R2:获取用于多学科工程应用的高性能深反应离子蚀刻系统
批准号:
0959695
负责人:
Jungsang Kim
金额:
$45.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2010
资助国家:
美国
项目状态:
已结题
起止时间:
2010-03-15 至 2011-02-28

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中文摘要
翻译
该奖项是根据2009年美国复苏和再投资法案(公法111-5)资助的。MRI-R2:多学科工程应用的高性能深反应离子蚀刻系统的收购本提案的目的是获得一个硅深反应离子蚀刻系统安装和操作的共享材料仪器设备在杜克大学。拟议系统的安装、操作和维护将由专职工程人员提供支持,以进行用户培训、操作和设备维护。这一安排确保了该工具的可持续长期运作,同时为来自大学、非营利研究机构和工业界的广大感兴趣的用户提供了机会,作为一种区域资源,这一建议的智力价值来自于该工具能够进行的广泛研究。所提出的系统能够执行宽范围的硅蚀刻工艺,包括高蚀刻速率蚀刻、高纵横比蚀刻、纳米尺度的深亚微米特征蚀刻、平滑侧壁蚀刻、绝缘体上硅衬底的最小底切、灵活的侧壁轮廓控制和高选择性蚀刻。这一工具预计将使多学科的研究活动,包括光学微机电系统,超材料在微米和纳米尺度,光子晶体和纳米光子器件,微发电机,精密封装解决方案的光学/电子设备和系统,太赫兹源,微流体设备,和低成本的图案技术,使用模具和邮票。更广泛的影响,这一计划有教育和经济方面。SMIF增加这一能力将为研究生和博士后研究人员提供更多的研究经验,这将有助于培养更高质量的劳动力,并使当地创业公司能够开发其核心技术,从而创造就业机会和经济增长。
英文摘要
This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5). MRI-R2: Acquisition of High Performance Deep Reactive Ion Etching System for Multidisciplinary Engineering ApplicationsThe objective of this proposal is to acquire a silicon deep reactive ion etching system to be installed and operated within the Shared Materials Instrumentation Facility at Duke University. The proposed system will be installed, operated and maintained with full-time engineering staff support for user training, operation and equipment maintenance. This arrangement ensures a sustainable long-term operation of the tool, while providing access to broad base of interested users from universities, non-profit research institutions and industry to serve as a regional resource.The intellectual merit of this proposal stems from the wide range of research this tool enables. The proposed system is capable of performing a wide range of silicon etching processes including high etch rate etch, high aspect ratio etch, deep sub-micron feature etch in the nanometer scale, smooth sidewall etch, minimal undercutting of silicon-on-insulator substrates, flexible sidewall profile control, and highly selective etch. This tool is expected to enable multidisciplinary research activities that encompass optical micro-electromechanical systems, metamaterials at the micro- and nano-scale, photonic crystals and nanophotonic devices, micro-power generators, precision packaging solutions for optical/electronic devices and systems, terahertz sources, microfluidic devices, and low-cost patterning technologies using molds and stamps.The broader impacts of this program have educational and economical aspect. Addition of this capability to SMIF will provide graduate students and postdoctoral researchers to expand their research experience that will help train a higher quality work force, and enable local startup companies to develop their core technology that will lead to job creation and economic growth.
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