SNM: A Versatile Microplasma-based Patterning Technology for Large-Scale, High Throughput Nanomanufacturing

该资助为开发基于微等离子体的直接写入制造工具提供资金，用于在刚性和柔性基板上生产低于100纳米的金属和金属氧化物器件结构。通过等离子体电子对分散在聚合物薄膜中的金属离子进行选择性电化学还原，形成图像化结构。不同的金属将被探索，包括银、金、铂、铜和钛。为了控制图案尺寸，一种耐用的纳米模板掩蔽技术将被纳入到该过程中。模拟和实验将探索和阐明模板几何形状和带电流体输运之间的关系，最终决定图案转移和缩放。同时，具有防潮性能的纳米层聚合物衬底将被开发用于耐用的柔性电子产品。这两种工艺技术将集成在一条卷对卷生产线上，以证明工艺的兼容性和可扩展性。所得到的金属纳米结构将被评估电导率、附着力、密度、表面粗糙度、图案保真度和对施加应变的响应等性能。将进行加速寿命测试，以评估结构在商业应用中的可行性。如果成功，这项研究将产生一种高度通用、低成本、高通量的方法，用于在柔性基板上制造纳米级结构和功能器件。基于微等离子体的图像化过程在室温下操作，使其与从硅到聚合物的各种衬底兼容，并且在大气压下，使其易于扩展到连续生产系统。该技术有潜力补充目前用于硅CMOS电子器件的最先进的直接写入纳米制造系统，并为柔性电子和传感器制造纳米级器件创造新的机会。此外，微等离子体工具与纳米层聚合物衬底的集成可以开发用于潜在湿气环境的柔性电子系统，包括植入式医疗微系统。

This grant provides funding for the development of a microplasma-based, direct-write fabrication tool to produce sub-100 nm metallic and metal oxide device structures on rigid and flexible substrates. The patterned structures will be formed by selective electrochemical reduction of metal ions dispersed in polymeric films by plasma electrons. Different metals will be explored including Ag, Au, Pt, Cu, and Ti. To control the pattern dimension, a durable nanostencil masking technology will be incorporated into the process. Simulations and experiments will be performed to explore and elucidate the relationship between the stencil geometry and charged fluid transport that ultimately determines the pattern transfer and scaling. Concurrently, nanolayered polymer substrates with moisture barrier properties suitable for durable flexible electronics will be developed. The two process technologies will be integrated on a roll-to-roll line to demonstrate process compatibility and scalability. The resulting metallic nanostructures will be evaluated for such properties as electrical conductivity, adhesion, density, surface roughness, pattern fidelity, and responses to applied strains. Accelerated lifetime testing will be performed to assess the viability of the structures in commercial applications.If successful, this research will result in a highly versatile, low-cost, high-throughput method for the fabrication of nanoscale structures and functional devices on flexible substrates. The microplasma-based patterning process is operated near room temperature, making it compatible with a wide variety of substrates ranging from silicon to polymers, and at atmospheric pressure, making it readily scalable to continuous production systems. The technology has the potential to complement state-of-the-art, direct-write nanofabrication systems currently used in silicon CMOS electronics, as well as creating new opportunities to fabricate nanoscale devices for flexible electronics and sensors. Additionally, integration of the microplasma tool with nanolayered polymer substrates could enable the development of flexible electronic systems for moisture latent environments including implantable medical microsystems.