Collaborative Research: Laser-driven Micro-Transfer Printing

该奖项的研究目标是开发一种新的制造工艺，即激光驱动微转移印刷（LMTP），使传统制造的微米和纳米结构从其手柄或生长基板轻松转移到功能基板。它利用了可印刷（微结构）油墨和携带它的印章对激光脉冲的响应差异，在印章-油墨界面处产生热失配应变。存储在该失配应变中的该能量驱动油墨从印模释放并将其转移到接收基底。利用实验观察和计算建模，本研究将寻求理解和表征过程中涉及的热机械现象。该知识将用于优化过程元素（例如，转印印模几何形状和材料）和参数，以允许低温、稳健的工艺行为。项目成果包括LMTP工艺的公开模型、知识和表征、用于LMTP工艺的带有仪表化打印头的计算机化制造工具、三维集成电路（3-D IC）封装和印刷多层微机电系统（MEMS）的演示、工程学生教育以及本科生的工程研究经验。该项目将为实现材料级异构功能集成提供一种简便有效的制造途径？在所需功能的精确位置处受控地插入微观功能装置。这种能力对于柔性电子、3D IC封装和集成微机电系统等新兴技术至关重要。研究生和本科工程专业的学生将受益于本项目中开发的课堂模块，以及通过参与研究。努力激励高中学生科学，技术，工程和数学（STEM）的职业生涯将受益于该项目将使高中夏令营的贡献。

The research objective of this award is to develop a new manufacturing process, Laser-driven Micro-Transfer Printing (LMTP), that enables the facile transfer of conventionally fabricated micro- and nanostructures from their handle or growth substrate to a functional substrate. It exploits the difference in the response of a printable (microstructure) ink and the stamp carrying it to a laser pulse to create a thermal mismatch strain at the stamp-ink interface. This energy stored in this mismatch strain drives the release of the ink from the stamp and its transfer to a receiving substrate. Using experimental observations and computational modeling, this research will seek to understand and characterize the thermo-mechanical phenomena involved in the process. This knowledge will be used to optimize the process elements (e.g., transfer stamp geometry and material) and parameters to allow for low-temperature, robust process behavior. Project deliverables include published models, knowledge and characterization of the LMTP process, a computerized manufacturing tool with an instrumented print head for the LMTP process, demonstrations of three-dimensional integrated circuit (3-D IC) packaging and printed multi-layer micro-electromechanical systems (MEMS), engineering student education, and engineering research experiences for undergraduate students.If successful, the project will provide a facile and efficient manufacturing pathway for realizing material-scale heterogeneous functional integration ? the controlled inserting of microscopic functional devices at the precise locations of the desired function. This type of capability is critical to emerging technologies such as flexible electronics, 3-D IC packaging and integrated micro-electromechanical systems. Graduate and undergraduate engineering students will benefit through classroom modules developed within this project as well as through involvement in the research. Efforts to motivate high school students to science, technology, engineering and mathematics (STEM) careers will benefit from the contributions that this project will make to high-school summer camps.