van der Waals mediated interaction dynamics between individual nanostructures

CBET-1403456沃克现代微电子器件广泛用于电信，计算和能量转换应用，依赖于不断缩小的特征尺寸，其中材料在原子尺度上进行操作，并表现出新的和极端的性能。 随着特征长度的减小，材料之间的界面开始主导材料的性能，并因此主导器件的性能。 然而，我们对电荷和热量如何通过这些界面传输的理解仍然有限。 为了创造更好的材料和器件，我们必须研究界面对载流子输运的影响，这是这些高度缩放结构所表现出的极端特性的原因。 该项目将测量通过几个精心控制的接口的能量流，并使用原子级建模来预测这些接口的性能。 理论和实验相结合的方法将产生新的设计规则，用于创建和优化未来的设备。 因此，该项目的结果具有深远的影响，并可能导致减少消耗我们的能源，更快的计算机，并增加通信bandwidth.The界面声子输运缺乏深入的了解是当前的瓶颈，在微电子冷却和热设计的复合材料。该项目旨在了解单个纳米结构之间的货车德瓦耳斯界面的相互作用动力学，这决定了这些界面处的声子传输和散射机制。 在货车德瓦耳斯界面的相互作用动力学将改变声子传输系数，导致不同的热导率之间的单，双带。 因此，我们的方法是系统地测量单个硅纳米带，硅双纳米带，硅和硼双带的本征热导率，并进行相应的原子尺度建模。 不同样品的结果比较将提供新的见解，不同的因素，如粘附能，声阻抗失配，和非晶层影响声子传输通过货车德瓦尔斯接口，这将提供新的见解操纵通过这些接口的热输运。 由于货车范德华界面是单个纳米结构或纳米结构与基底/主体材料之间最常见的界面之一，因此所获得的基本理解将有助于更好地管理微电子器件中的散热并调节纳米复合材料的热性能。

CBET-1403456WalkerModern microelectronic devices extensively used in telecommunications, computing, and energy conversion applications rely on ever shrinking feature sizes where materials are manipulated at atomic scale and exhibit new and extreme properties. As characteristic lengths decrease, interfaces between materials begin to dominate the performance of the materials, and hence the devices. Yet, our understanding of how charge and heat transmit through these interfaces is still limited. To create better materials and devices, we must study the effects of interfaces on carrier transport that are responsible for the extreme properties these highly scaled structures exhibit. This project will measure the flow of energy through several carefully controlled interfaces and predict the performance of those interfaces using atomistic-scale modeling. The combined theoretical and experimental approach will produce new design rules for creating and optimizing future devices. Consequently, the results of this project have far reaching implications and could lead to a reduced drain on our energy resources, faster computers, and increased communication bandwidth.The lack of thorough understanding of interfacial phonon transport is a current bottleneck in microelectronic cooling and thermal design of composite materials. This project aims at understanding the interaction dynamics of van der Waals interfaces between individual nanostructures, which determines the phonon transmission and scattering mechanisms at these interfaces. The interaction dynamics at the van der Waals interface will alter the phonon transmission coefficient, leading to different thermal conductivities between single and double ribbons. Therefore, our approach is to measure systematically the intrinsic thermal conductivity of individual silicon nanoribbons, silicon double nanoribbons, and silicon and boron double ribbons, and to perform corresponding atomic scale modeling. Comparison of results from different samples will provide new insights into how different factors, such as adhesion energy, acoustic impendence mismatch, and amorphous layers affect phonon transmission through van der Waals interfaces, which will provide new insights into manipulating thermal transport through these interfaces. Since van der Waals interfaces are one of the most common interfaces between individual nanostructures or nanostructures and substrates/host materials, the obtained fundamental understanding will shed light on how to better manage the heat dissipation in microelectronic devices and tune the thermal properties of nanocomposites.