Hyperspectral chromatical reflectometer for measuring of moving objects

表面轮廓和薄膜厚度的检测是许多工艺链的重要问题，例如在半导体生产中。在测量系统和传感器技术研究所，已经开发出用于薄膜厚度控制的一维测量系统，该系统能够同时测量表面轮廓和距离。因此，表面轮廓和薄膜厚度的同时重建是可行的。由于系统仅在一维上测量，因此需要对表面进行扫描。卫星测量技术也解决了类似的问题：成像高光谱系统通过光谱扫描行星表面，从而得出有关表面状况的结论。本研究项目旨在将这两个领域的经验联合收割机结合起来。最后，一个二维高光谱薄膜反射计将建立，演示了表面拓扑结构和薄膜厚度的同时测量。将通过模拟和实验研究大规模生产技术在选定应用中的使用，例如在半导体生产，医药技术，有机传感器系统或生物技术中。

The inspection of surface contour and thin film thickness is an important issue of many process chains, e.g. in semiconductor production. At the Institute for Measurement Systems and Sensor Technology a one-dimensional measurement system for thin film thickness control has been already developed, which is able to simultaneously measure surface contour and distance. Thus, the simultaneous reconstruction of surface contour and thin film thickness is feasible. Since the system measures only in one dimension, a scanning of the surface is necessary. A similar problem has been solved in the satellite-based measurement technology: An imaging hyperspectral system spectroscopically scans the surface of a planet and allows drawing conclusions about surface conditions.This research project aims to combine experiences of both areas. Finally, a two-dimensional hyperspectral thin film reflectometer will be built up, demonstrating the simultaneous measurement of surface topology and thin film thickness. The use in selected applications of mass production technology, e.g. in semiconductor production, medicine technology, organic sensor systems or biological technology, will be investigated by simulations and experiments.