SBIR Phase I: Laser-Enabled Massively Parallel Die Transfer for ?LED Displays

这个小型企业创新研究(SBIR)第一阶段项目更广泛的影响/商业潜力是将显示器和照明产品的功耗降低90%。它将通过在这类产品中普遍使用发光二极管(LED)来做到这一点。与其他显示/照明技术相比，LED的耗电量要低得多，而且还具有卓越的图像或照明质量和更长的使用寿命等优点。这类产品出现的最大障碍是难以经济地将大量LED放置在产品网格上。例如，如果使用当前的方法来制造全高清晰度显示器，其组装将需要大约一个月的时间，并使其成本远远超出市场可以接受的范围。该项目的创新之处在于提供了一种基于激光的超高速LED贴装解决方案。除了这一立竿见影的应用外，它还将进一步提高整个行业在电子元件组装方面的技术能力。基于芯片的LED显示屏和照明产品的商业潜力预计在五年内达到约100亿美元。在同一时间框架内，支持这些产品的LED贴装解决方案的市场将达到约10亿美元。拟议的项目通过展示一种超高速LED贴装方法来解决上述问题，该方法可以将上例中一个月的组装时间减少到仅一分钟。与正在开发的其他解决方案不同，该解决方案将LED的安装率提高了10,000倍，并包括预筛选和更换不起作用的LED的能力。该项目将演示该解决方案的核心方面，包括使用单个激光脉冲衍射成多个扫描光束来放置多个非常小的LED(“微LED”)。它将使用这一解决方案来演示基于量子点的微型LED显示器的极快组装。该项目将建立在先前证明的适用于较大硅晶片的相关能力的基础上。该技术的每个方面(晶片制备、单光束放置、多光束放置)都将针对较小尺寸的蓝宝石微LED施加的新条件进行单独优化。这种为LED量身定做的新功能将用于在不到一秒的时间内演示4000像素microLED显示屏的组装，从而实现该项目演示50M单元/小时LED放置速度的目标。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is to reduce the power consumption of display and lighting products by 90%. It will do so by enabling the pervasive use of light emitting diodes (LEDs) in such products. LEDs consume substantially less power than other display/lighting technologies and also offer benefits such as superior picture or lighting quality and longer lifespan. The foremost barrier to the emergence of such products is the difficulty of economically placing large quantities of LEDs onto a product grid. For example, if current-day methods are used to create a full high definition display, its assembly would take about a month and drive its cost far beyond what the market could accept. This project's innovation addresses this problem with a laser-based, ultra-high speed LED placement solution. Beyond this immediate application, it will further the industry's technical capabilities relative to electronics component assembly in general. The commercial potential for chip-based LED display and lighting products is expected to reach about $10 billion within five years. The market for LED placement solutions in support of these products will be about $1 billion in this same time frame.The proposed project addresses the above problem by demonstrating an ultra-high speed LED placement method that can reduce the one month assembly time in the example above to just one minute. This solution, unlike others in development, increases the placement rate of LEDs by a factor of 10,000 and includes the ability to pre-screen and replace non-functional LEDs. This project will demonstrate the core aspect of this solution involving the placement of multiple, very small LEDs ("microLEDs") using a single laser pulse diffracted into multiple scanned beams. It will use this solution to demonstrate the extremely fast assembly of a quantum dot-based microLED display. The project will build upon a related, previously demonstrated capability applied to larger, silicon dies. Each aspect of the technology (wafer preparation, single laser beam placement, multi-beam placement) will be individually optimized for the new conditions imposed by the smaller sized, sapphire-based microLEDs. This new, LED-tailored capability will then be used to demonstrate the assembly of a four thousand pixel microLED display in under one second thereby achieving the project's goal of demonstrating a 50M units/hour LED placement rate.