SBIR Phase II: Ultrasoft Thermal Interface Elastomer for Microelectronics

这项小型企业创新研究（SBIR）第二阶段项目的更广泛/商业影响是提高电子设备的效率和性能。包括手机、笔记本电脑和电动汽车在内的现代设备都含有高功率的半导体组件，这些组件会产生不必要的热量，从而降低它们的效率。如果不加以控制，这种热量可能会损坏设备，甚至伤害用户或对环境造成破坏。该项目通过在可拉伸聚合物中嵌入液态金属液滴的新型高性能热界面材料来解决电子设备中的过度加热问题。这些所谓的液态金属嵌入式弹性体（LMEE）材料可以应用于计算机处理器、图形卡、先进的人工智能（AI）芯片，甚至电动汽车的电源模块，以帮助电子设备始终以最高性能运行。物联网、5G网络基础设施和电动汽车的日益普及都需要更好的散热解决方案，以便设备能够正常运行。该项目可为半导体、汽车和医疗保健行业做出贡献。该项目的目标是在LMEE复合架构的基础上，开发用于封装微电子的热界面材料（TIM）并使其商业化。该技术结合了金属基固体TIMs （S-TIMs）优越的耐热性、聚合物基TIMs的机械可靠性以及热润滑脂的大批量制造兼容性，将超越现有的TTIMs。具体来说，LMEEs在固化前具有类似金属的耐热性、类似橡胶的弹性和类似液体乳液的流变性，从而解决了现有S-TIMs存在的两个主要挑战：(i)长时间内机械可靠性差；（ii）与大批量生产的注射器点胶不兼容。本项目提出的策略是合成一种基于lmee的TIM，该TIM在半导体芯片和周围外壳表面之间形成坚固的键合，保持芯片和外壳之间的控制厚度，并确保注射器式点胶所需的流变性。具体的项目任务建立在一个全面的技术计划周围，包括材料合成、性能表征和封装评估。同时，该项目将检查存储，运输和分配方法，以确保在项目结束时为集成设备制造商和半导体组装和测试行业准备好产品。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

The broader/commercial impact of this Small Business Innovation Research (SBIR) Phase II project is in improving the efficiency and performance of electronic devices. Modern devices, including cell phones, laptops, and electric vehicles contain high-powered semiconductor components which generate unwanted heat that, in turn, reduces their efficiency. If left unchecked, this heat may destroy the devices and even injure users or cause damage to the environment. This project addresses excessing heating in electronic devices by introducing new high-performance thermal interface materials based upon embedding liquid metal droplets inside of stretchable polymers. These so-called liquid metal embedded elastomer (LMEE) materials can be applied to computer processors, graphics cards, advanced artificial intelligence (AI) chips, and even power modules in electric vehicles, to help keep electronic devices operating at peak performance at all times. The growing prevalence of the Internet of Things, 5G network infrastructure, and electric cars all necessitate better thermal solutions so that devices can function properly. This project could contribute to the semiconductor, automotive, and healthcare industries.This project’s goal is to develop and commercialize a thermal interface material (TIM) for packaged microelectronics, building upon the LMEE composite architecture. The technology will outperform existing TTIMs by combining the superior thermal resistance of metal-based solid TIMs (S-TIMs) with the mechanical reliability of polymer-based TIMs and the high-volume manufacturing compatibility of thermal greases. Specifically, LMEEs possess a unique combination of metal-like thermal resistance, rubber-like elasticity, and liquid emulsion-like rheology prior to curing, thereby solving two main challenges present with existing S-TIMs: (i) poor mechanical reliability over long durations and (ii) incompatibility with syringe-based dispensing for high volume manufacturing. The strategy proposed in this project is to synthesize an LMEE-based TIM that forms a robust bond between the surfaces of the semiconductor chip and surrounding enclosure, maintains a controlled thickness between the chip and enclosure, and ensures the necessary rheology for syringe-based dispensing. Specific project tasks build around a comprehensive technical plan that includes materials synthesis, performance characterization, and in-package evaluation. In parallel, the project will examine methods for storage, shipment, and dispensing to ensure a product that is ready for integrated device manufacturers and semiconductor assembly and testing industry by the end of this project.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.