FMSG: Eco: Field Assisted Nano Assembly System (FANAS) for Next-Generation Photonics and Quantum Computing

物理学家和工程师们在结构材料中发现了许多新的光学现象，如负折射和光的非平凡拓扑。简而言之，在纳米光子学中，结构决定功能。特别是，三维（3D）光子结构具有令人兴奋的潜力，新的计算模式。然而，事实证明，实现其潜力具有挑战性。3D结构光子器件的英雄演示已经使用堆叠或自组装实现。这些方法缺乏设计灵活性，或者不能按比例扩大生产。该项目的重点是使用一种新的制造平台推进3D光子结构的设计和制造：场辅助纳米组装系统（FANAS）。该平台使用热场和声场将液滴引导到精确位置，构建具有亚微米分辨率的3D光子结构。FANAS的成功实施将导致未来制造系统能够大规模生产新型3D纳米光子结构。该项目将为快速光学平台带来新的机遇，影响数十亿美元的量子计算行业。调查人员将把研究与威斯康星州-麦迪逊大学的妇女科学工程（WiSE）计划等外展计划结合起来，以促进多样性和包容性。该项目还将与威斯康星州MRSEC本科生研究经验（REU）合作，招募并与代表性不足的群体的学生合作。该项目还将丰富调查人员通过其机构主办的工程博览会日与K-12学生的联系。最后，该小组将发起一系列研究专题讨论会，以促进劳动力发展和传播研究成果。该项目由材料研究部（DMR）和电气、通信和网络系统部（ECCS）共同资助。技术说明量子技术依赖于光子作为量子比特的载体。3D光子学提供了一个新的维度来控制小规模的光。这种控制可以增强光子量子比特的存储、传输和转换能力。该项目的总体目标是研究基于波动力学物理学的3D光子学的新设计定理和制造原理。在FANAS系统中，利用声学场、电流体力学场和热场来构建为3D光子学和量子计算设计的异质3D结构。这些结构将通过开发将量子点和染料分子精确放置在3D光子结构中的方法来实现。一种新的计算方法将被开发来模拟量子发射器和复杂的3D光子结构之间的相互作用。多物理场建模也将促进对材料与应用场相互作用的理解。多个领域的集成使制造方法的多功能性达到前所未有的水平，因为材料的化学和物理特性都被利用来实现组装和目标性能。现场辅助装配平台能够：（1）纳米颗粒和纳米材料在微米/亚微米尺度上的组装、对准和图案化，2）精确的液滴生成和飞行行为控制，3）可以使用按需滴注概念按比例放大的复杂3D结构的制造，以及4）通过案例研究的新型器件制造和演示，以用于未来在3D光子学和量子计算中的更广泛应用。该项目位于两个美国国家科学基金会的10个大的想法-增长融合研究和美国芯片和科学法案的交叉点。该奖项反映了美国国家科学基金会的法定使命，并已被认为是值得通过评估使用基金会的知识价值和更广泛的影响审查标准的支持。

Non-technical DescriptionPhysicists and engineers have discovered many new optical phenomena in structured materials, such as negative refraction and nontrivial topology of light. Put simply, in nano photonics, structure determines function. In particular, 3-dimensional (3D) photonic structures have exciting potential for new computing paradigms. However, realizing their potential has proven challenging. Hero demonstrations of 3D structured photonic devices have been achieved using stacking or self-assembly. These approaches lack design flexibility or cannot be scaled up for production. This project focuses on advancing the design and fabrication of 3D photonic structures using a novel manufacturing platform: Field Assisted Nano Assembly System (FANAS). This platform uses thermal and acoustic fields to guide droplets to precise locations, building 3D photonic structures with submicron resolution. Successful implementation of FANAS will result in a Future Manufacturing system capable of producing novel 3D nano photonic structures reproducibly at scale. This project will enable new opportunities for fast optics platforms, impacting the multi-billion-dollar quantum computing industry. Investigators will integrate research with outreach programs such as Women in Science & Engineering (WiSE) program at the University of Wisconsin – Madison to promote diversity and inclusion. The project will also partner with the Wisconsin MRSEC Research Experience for Undergraduates (REU) to recruit and work with students from underrepresented groups. This project will also enrich the investigators’ outreach to K-12 students through an Engineering Expo Day hosted by their institution. Finally, the team will launch a series of research symposiums for workforce development and dissemination of research outcomes. This project is jointly funded by the Division of Materials Research (DMR) and the Division of Electrical, Communications, and Cyber Systems (ECCS).Technical DescriptionQuantum technology relies on photons as the carrier of the qubit. 3D photonics provides a new dimension to control light at small scale. Such control can enhance the ability in the storage, transfer, and transduction of photonic qubits. The overarching objective of this project is to investigate new design theorems and manufacturing principles for 3D photonics based on the physics of wave dynamics. In the FANAS system, acoustic-, electrohydrodynamics-, and thermal- fields are utilized to construct heterogeneous 3D structures designed for 3D photonics and quantum computing. These structures will be realized by developing methods to precisely place quantum dots and dye molecules in a 3D photonic structure. A new computational method will be developed to model the interaction between quantum emitters and complex 3D photonic structures. The multi-physics modeling will also advance the understanding of material interactions with the applied fields. The integration of multiple fields brings the versatility of the manufacturing method to an unprecedented level, since both the chemical and physical properties of the materials are exploited to achieve assembly and targeted performance. The field-assisted assembly platform enables: (1) assemble, alignment, and patterning of nanoparticles and nanomaterials at the micro/sub-micron scale, 2) precise droplet generation and flight behavior control, 3) manufacturing of complex 3D structures that could be scaled up using drop-on-demand concepts, and 4) novel device fabrication and demonstration via case studies for future broader applications in 3D photonics and quantum computing. This project lies at the intersection of two of the NSF’s 10 Big Ideas – Growing Convergence Research and the United States Chips and Science Act.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.