A Study on the Development of an Insert Metal for Welding

钎焊和扩散连接技术已被公认为现代高新技术中的重要基础技术，其性能取决于镶件金属的特性和发展。我们从以下三个方面对镶块金属和焊接工艺的发展进行了研究。a）使活性金属、其合金和具有稳定的氧化物表面膜的金属更容易焊接。B）以低能量焊接工艺（尽可能低的温度下的焊接工艺）为最终目标。（3）更容易、更可靠地实现金属与陶瓷的焊接本研究取得的主要新成果和现状如下：1）选择工业纯钛和Ti-Ni形状记忆合金作为活性金属。对于纯钛，Zr基钎料Zr-47 Cu的开发，以提供足够的强度和耐腐蚀性的钎焊接头。此外，我们还成功地开发了焊剂和银基填料 ...更多信息 Er金属，使形状记忆合金的空气钎焊成为可能。2）我们对嵌入金属和铝的焊接工艺进行了一些考虑，铝是一种典型的金属，具有紧密稳定的氧化物表面膜，以增加扩散结合性和钎焊性。在Al基金属或填充金属中存在的约1wt%的镁被证明对于减少铝的氧化膜和提高扩散结合性是非常有效的。此外，我们还尝试了铝的空气钎焊。采用Zn基钎料，在超声波辅助下完成了铝合金的空气钎焊。3）制备了Ni基、Fe基和Cu基快速凝固金属带，并将其在低温下的软化特性应用于焊接过程。Cu基快速凝固金属变得有点软化，但是，软度不足以应用于焊接。4）将氧化铝或氮化铝钎焊到纯铜上用于构建IC封装。我们目前正试图生产一种更便宜和更低熔点的钎料，用于将这些陶瓷钎焊到纯铜上。少

The performance of the brazing and the diffusion bonding which have been recognized as the important primary technology in the modern high-techs depends on the characteristics and the development of an insert metal. We made study on the development of insert metal and welding process from the following three viewpoints. a) To weld more easily an active metal, its alloy and the metal having a stable oxide surface film. b) To aim the low-energy welding process (welding process at as low temperature as possible), which is taken as a final goal. c) To weld more easily and more surely metals to ceramics.The main new results obtained in this study and a present state are as follows.1) We chose a pure commercial titanium and a Ti-Ni shape memory alloy as an active metal. As for the pure Ti, Zr-based brazing filler metal of Zr-47Cu was developed to give sufficient strength and corrosion resistance to the brazed joint. Furthermore, we succeeded in the development of the fluxes and Ag-based fill … More er metals to make brazing the in-air brazing of the shape memory alloy possible.2) We made some considerations about the insert metals and the welding process for an aluminum which is a typical metal having a tight stable oxide surface film to increase the diffusion bondability and brazability. The magnesium of about 1 wt% existing in the Al base metal or the filler metal was proved to be very efficient to reduce the oxide film of aluminum and to increase the diffusion bondability. Furthermore, we tried to make the brazing or soldering in air of the aluminum. The in-air brazing of the aluminum was completed using an Zn-based filler metal and being aided with an ultrasonic wave.3) We made some kinds of rapidly solidified metal tape of Ni-base, Fe-base and Cu-base, and followed by t ing to apply their softening property exerted at lower temperature on reheating to welding process. The Cu-based rapidly soldified metal became a little softened, however, the softness was not so enough to be applied to welding.4) The brazing alumina or aluminum nitride to pure copper is being used to build up an IC package. We are presently trying to produce a cheaper and lower melting point filler metal for brazing these ceramics to pure copper. Less