Sputter Deposition Cluster Tool

对于记忆器件的制造，需要一个高效的PVD系统进行研究和中试生产。该系统旨在实现各种磁性和非磁性材料的溅射沉积，以及适用于氧化物和氮化物层的反应性溅射工艺。为此，该系统应同样适用于导电和非导电/绝缘、磁性和非磁性基板和基板材料。具体来说，该系统需要5个独立的真空室：一个负载观察室，一个真空机器人转移室，2个溅射室，共有6个溅射源（一个用于研究项目，另一个用于中试生产），氧化室用于隧道屏障，集成射频偏置，用于基板清洁。工艺方向应处于溅射状态。每个腔室需要一个专用的涡轮分子泵送系统。采用直流、脉冲直流和射频共聚焦磁控溅射源可以实现层沉积。可控制的工艺气体入口和可操作的6英寸衬底级（旋转、加热、冷却、射频偏置、梯度孔径）也被要求开发用于记忆器件的新型功能层。需要单独可调的靶/基板间距，以允许在晶圆上沉积具有良好均匀性的薄层。可拆卸不锈钢挡泥板的设计有助于减少内部工艺室表面不需要的涂层。此外，所要求的系统应通过由用户可编程的自动、配方控制的涂层过程来控制。这应该允许有一个可重复的制造记忆器件。

For the fabrication of memristive devices an efficient PVD system for research and pilot productions is requested. The system is intended to enable the sputter deposition of various magnetic and non-magnetic materials, as well as to be suitable for reactive sputtering processes of oxide and nitride layers. For this purpose, the system should be equally usable for conductive and non-conductive / insulating, magnetic and non-magnetic substrates and substrate materials. Specifically, a system is being requested with 5 independent vacuum chambers: one load look chamber, one vacuum robotic transfer chamber, 2 sputtering chambers with a total of 6 sputtering sources (one used for research projects and the second for pilot production), oxidation chamber for tunnel barriers with integrated RF bias for substrate cleaning. The process direction should be in the sputter-down configuration. A dedicated turbomolecular pumping system for each chamber is desired. The layer deposition should be possible by confocal magnetron sputtering sources with DC, pulsed DC and RF supply. A controllable process gas inlet and manipulatable 6-inch substrate stages (rotating, heating, cooling, RF bias, gradient aperture) are also requested to develop novel functional layers for memristive devices. Individually adjustable target / substrate spacing is desired to allow the deposition of thin layers with a good homogeneity over the wafer. Removable stainless steel fenders are designed to help reduce unwanted coating on the inner process chamber surfaces. In addition, the requested system should be controlled via an automatic, recipe-controlled coating process, which is programmable by the user. This should allow to have a reproducible fabrication of memristive devices.