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Active Millimeter-Wave On-Wafer Measurement Probe

Active Millimeter-Wave On-Wafer Measurement Probe
有源毫米波晶圆上测量探头
批准号:
446397162
负责人:
Professor Dr.-Ing. Dietmar Kissinger
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants
财政年份:
--
资助国家:
德国
项目状态:
未结题
起止时间:

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中文摘要
翻译
毫米波集成电路(MMIC)的特性需要使用网络分析仪、频率扩展模块和晶片上测量的非常昂贵的设置。将晶片上的探头连接到扩展模块的波导以及扩展模块本身是可实现的瞬时频率范围的重要限制因素。因此,一个非常宽带的最先进的MMIC的完整特征需要使用不同频率范围的不同频率扩展模块和晶片上的探头进行不切实际的多次测量。此外,扩展模块的大尺寸禁止它们与探针卡一起使用,探针卡包括大量探头。这严重限制了现代多通道雷达和通信收发器快速、低成本验证方法的发展。在ActionPro中,我们希望探索毫米波在片测量技术的新架构和方法,其中多个频率扩展模块与多路复用器一起集成到在片探针中。新架构将具有以下优势:-从DC到几个100 GHz的超宽带宽-不受导带的瞬时带宽限制-非常紧凑的尺寸,允许集成到探针卡中或在探针站上更灵活。新架构的一个非常有趣的应用是将现有的DC-110 GHz宽带网络分析系统以可持续的低成本扩展到DC-220 GHz。在ActionPro中,我们将探索这一新概念的可行性,并实现这一DC-220 GHz解决方案的首次演示。为此,我们使用最新的IHP BiCMOS技术开发了由110 GHz至220 GHz的倍频器、混频器、放大器和耦合器组成的频率扩展模块电路。这些频率扩展模块安装在探头中,并且都通过多路复用器连接到同一探头。此外,多路复用器通过1 mm同轴连接器将DC至110 GHz的低频信号直接路由至现有矢量网络分析仪的商用频率扩展模块。一种基于共面线的新型超宽带连接器将允许更换探头尖端,从而适应探头尖端和新探头的其余部分的不同寿命。在实际设计的同时,根据所需的芯片空间、IC性能和多路复用器的插入损耗对系统使用频段的数量进行研究,将有助于优化详细的系统架构。有了ActionPro,所有功能都将被封装到探头外壳中,从而形成紧凑、完全集成的超宽带晶片上测量探头,并带有集成的频率扩展模块。
英文摘要
The characterization of millimeter-wave integrated circuits (MMICs) requires a highly expensive setup using a network analyzer, frequency extension modules and an on-wafer measurement. The waveguide connecting the on-wafer probe to the extension module, as well as the extension module itself, are significantly limiting factors for the achievable instantaneous frequency range. Hence, a full characterization of a very broadband state-of-the-art MMIC requires an impractical multiple number of measurements with different frequency extension modules and on-wafer probes for the different frequency ranges. In addition, the large size of the extension modules prohibits their use together with probe cards, which includes a high number of probes. This severely limits the development of fast and low-cost verification methods for modern multi-channel radar and communication transceivers.In ActiOnPro we want to explore novel architectures and methodologies for millimeter-wave on-wafer measurement techniques where several frequency extension modules are integrated together with multiplexers into the on-wafer probes. The new architecture will have the following advantages:- Ultra-broad bandwidth from DC to several 100 GHz- No limitation of instantaneous bandwidth by wave-guide bands- Very compact size allowing integration in probe cards or just more flexibility on the probe stationOne very interesting application of the new architecture is to generate a sustainable low-cost extension of an existing DC-110 GHz broadband network analyzer system to DC-220 GHz. In ActiOnPro we will explore the feasibility of the new concept and realize a first demonstration of this DC-220 GHz solution.For this purpose, the latest IHP BiCMOS technology is used to develop frequency extension module circuits consisting of frequency multipliers, mixers, amplifiers and couplers between 110 GHz and 220 GHz. These frequency extension modules are mounted into the probe and all connected to the same probe tip via a multiplexer. In addition, the multiplexer routes low frequency signals from DC to 110 GHz directly to the commercial frequency extension module of the existing vector network analyzer through a 1 mm coax connector. A novel ultra-broadband connector based on coplanar lines will allow replacement of probe tips and thus accommodate the different life time of the probe tip and the rest of the new probe. In parallel to the practical designs a study of the system behavior depending on the number of used frequency bands considering the required chip space, IC performance and the multiplexer’s insertion loss will help to optimize the detailed system architecture. With ActiOnPro all functionalities will be packaged into the probe housing resulting in a compact, fully integrated ultra-broadband on-wafer measurement probe with integrated frequency extension modules.
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会议论文
Flexible Electronic-Photonic Integrated Circuit Sensor Platform II [EPIC-Sense II]
Sub-THz scalable Sensor-SoC
  • 批准号:
    347375319
  • 项目类别:
    Research Grants
  • 资助金额:
    $0.0万
  • 财政年份:
    2017
  • 负责人:
    Professor Dr.-Ing. Dietmar Kissinger
  • 依托单位:
Hybrid Phased Array Antenna System for High Data Rate mm-Wave Wireless Communication (HyPAA)
Integrated Lab-on-Chip Terahertz-Spectroscopy Platform in BiCMOS Technology II (THz-LoC II)
国内基金
海外基金
Millimeter-waveHolographicAntennaandItsIntegrationwithActiveChip
  • 批准号:
    --
  • 项目类别:
    --
  • 资助金额:
    80万元
  • 批准年份:
    2022
  • 负责人:
    沈一竹
  • 依托单位: