Development of Functional Organic Coating with Self -Repair Ability for Future Corrosion Resistance Film
Development of Functional Organic Coating with Self -Repair Ability for Future Corrosion Resistance Film
批准号:
14350389
负责人:
NAKANO Hiroaki
金额:
$9.28万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2002
资助国家:
日本
项目状态:
已结题
起止时间:
2002 至 2004
中文摘要
采用循环伏安法研究了电解因素对在Zn基体上电聚合聚(2乙烯基吡啶)涂层形成的影响。用循环伏安法电聚合聚(2-乙烯吡啶)涂层的量与镀液的pH有显著的关系,在pH5时得到最大的涂层量。这一结果表明,在电聚合过程中,电解液中质子的数量对2-乙烯基吡啶的电聚合起着重要的作用。析氢对镀层形貌有明显的影响。在电解条件下,随着析氢速率的提高,镀层中含有大量的凹坑和条纹。循环伏安法制备的聚(2-乙烯吡啶)涂料在20 ~ 30℃的pH5浴中表现良好。另一方面,通过计时安培法测得的聚合电流密度在声膜形成初期突然减小,随后随着声膜厚度的增加而减小。在3% NaCl溶液中,锌板表面涂覆聚2-乙烯基吡啶,降低了锌板的阳极和阴极电流密度。在含甲醇的pH5水溶液中,采用恒流技术在30℃下在Zn衬底上电聚合聚2乙烯基吡啶薄膜。用循环伏安法和恒电位法制备了膜,并与恒流电解法制备的膜进行了比较。恒流电解形成的薄膜厚度随库仑的增加而增加,但随着电流密度的增加而减少,这是由于析氢量的增加。根据FT-IR光谱和膜的颜色推测,随着电流密度的增加,聚2-乙烯基吡啶薄膜的结构由无支链型转变为支链型。涂覆聚2-乙烯基吡啶薄膜可显著降低锌在3% NaCl溶液中溶解的阳极电流密度。在50A/m^2电聚合时,阳极反应受到最大抑制,表现出优异的耐蚀性。虽然电化学技术对膜的厚度和结构没有影响,但恒流电解形成的膜含有最少的裂纹,最大限度地提高了膜的耐蚀性。少
英文摘要
The effects of electrolysis factors on the formation of poly(2vinylpyridine) coatings electropolymerized on Zn substrate have been investigated by cyclic voltammetry technique. The amount of poly(2-vinylpyridine) coatings electropolymerized by cyclic voltammetry was significantly dependent on the pH of the bath and the maximum amount of coating was obtained at pH5. This result suggested that the specific amount of proton in the bath should play an important role in the electropolymerization of 2-vinylpyridine. The morphology of the coatings was evidently affected by the hydrogen evolution. Under the electrolysis conditions where the hydrogen evolution rate was increased, the coatings contained many pits and streaks caused by vigorous hydrogen evolution. The poly(2-vinylpyridine) coatings produced by cyclic voltammetry were fine in the bath of pH5 at 20 to 30℃. On the other hand, the current density for polymerization by chronoamperometry was abruptly decreased in the initial stage of t … More wo-dimensional coating formation, then it was subsequently decreased with an increase in the thickness of sound coating. The anode and cathode current density of Zn plate in 3% NaCl solution was decreased by poly(2-vinylpyridine) coating formation on it.The poly(2vinylpyridine) films were electropolymerized on Zn substrate by galvanostatic technique at 30 ℃ in the pH5 aqueous solution containing methanol. The films were also formed by cyclic voltammetry and potentiostatic techniques and were compared with those by galvanostatic electrolysis. The thickness of films formed by galvanostatic electrolysis was increased in proportion to the amount of coulombs but decreased with increasing the current density because of an increase in hydrogen evolution. Based on the FT-IR spectra and the color of films, it was presumed that the structure of poly(2-vinylpyridine) films was changed from non-branched to branched chain type with an increase in current density. The anodic current density for Zn dissolution in 3% NaCl solution were significantly decreased by coating poly(2-vinylpyridine) films. At 50A/m^2 of electropolymerization, the anodic reaction was most inhibited, showing the excellent corrosion resistance. Although the electrochemical techniques had no effect on the thickness and the structure of films, the films formed by galvanostatic electrolysis contained the least cracks to most improve the corrosion resistance. Less
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Formation of Poly(2-vinylpyridine) Films on Zn by Galvanostatic Electropolymerization
恒电流电聚合法在 Zn 上形成聚(2-乙烯基吡啶)薄膜
DOI:
--
发表时间:
2005
期刊:
MATERIALS TRANSACTIONS 46
影响因子:
--
作者:
[N.Yasumaru, K.Miyazaki, J.Kiuchi, 中野博昭]
通讯作者:
中野博昭
Zn板上への2-ビニルピリジン電解重合膜の形成に及ぼす電解因子の影響
电解因素对锌板上2-乙烯基吡啶电聚合膜形成的影响
DOI:
--
发表时间:
2002
期刊:
鉄と鋼 88
影响因子:
--
作者:
[V.Parkhutik, J.Sasano, Y.Ogata, E.Matveeva, 李 相弼]
通讯作者:
李 相弼
Effect of Electrolysis Factors on the Formation of Poly (2-vinylpyridine) Coatings Electropolymerized on Zn
电解因素对锌电聚合聚(2-乙烯基吡啶)涂层形成的影响
DOI:
--
发表时间:
2002
期刊:
Journal of Tetsu-to Hagane 88
影响因子:
--
作者:
[M.Isshiki, et al., Sang-Pil Lee]
通讯作者:
Sang-Pil Lee
李 相弼: "Zn板上への2-ビニルピリジン電解重合膜の形成に及ぼす電解因子の影響"鉄と鋼. 88・9. 513-519 (2002)
Sang-bi Lee:“电解因素对 Zn 板上 2-乙烯基吡啶电聚合膜形成的影响”Tetsu-to-Hagane 88・9 (2002)。
DOI:
--
发表时间:
期刊:
影响因子:
--
作者:
[]
通讯作者:
Development of the electrodeposition process for functional polymer films containing cation onto steel sheets
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